ESD122 Series
Dual 0.2-pF, ±3.6-V, ±17-kV ESD protection diode for USB Type-C and HDMI 2.0
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
Dual 0.2-pF, ±3.6-V, ±17-kV ESD protection diode for USB Type-C and HDMI 2.0
| Part | Bidirectional Channels | Voltage - Clamping (Max) @ Ipp | Voltage - Reverse Standoff (Typ) | Capacitance @ Frequency | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Power - Peak Pulse | Power Line Protection | Voltage - Breakdown (Min) [Min] | Type | Package / Case | Supplier Device Package | Supplier Device Package [x] | Supplier Device Package [y] | Applications | Current - Peak Pulse (10/1000µs) | Utilized IC / Part | Supplied Contents | Function |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments ESD122DMYR | 2 | 8.4 V | 3.6 V | 0.2 pF | -40 °C | 125 °C | Surface Mount | 20 W | 5.1 V | Zener | 3-XFDFN | 3-X2SON | 1.3 | 0.6 | HDMI, USB | 2.5 A | ||||
Texas Instruments ESD122DMXR | 2 | 8.4 V | 3.6 V | 0.2 pF | -40 °C | 125 °C | Surface Mount | 20 W | 5.1 V | Zener | 3-XFDFN | HDMI, USB | 2.5 A | |||||||
Texas Instruments ESD122DMX-EVM | ESD122 | Board(s) | Transient Voltage Suppression (TVS) | |||||||||||||||||
Texas Instruments ESD122DMY-EVM | ESD122 | Board(s) | Transient Voltage Suppression (TVS) |
Key Features
• IEC 61000-4-2 Level 4 ESD Protection±17-kV Contact Discharge±17-kV Air Gap DischargeWithstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradationIEC 61000-4-4 EFT Protection80 A (5/50 ns)IEC 61000-4-5 Surge Protection2.5 A (8/20 µs)Low IO Capacitance0.1 pF (Typical) between IOs0.2 pF (Typical) IO to GNDDC Breakdown Voltage: 5.1 V (Minimum)Ultra Low Leakage Current: 10 nA (Maximum)Low ESD Clamping Voltage: 8.4 V at 5-A TLPSupports High Speed Interfaces that exceed 10 GbpsIndustrial Temperature Range: –40°C to +125°CType C Friendly Two Channel Flow-Through Routing PackagePin-out to suit symmetric differential high-speed signal routingTwo Different Package Options0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch0502 Package, 0.6 mm × 1.32 mm, 0.5-mm PitchIEC 61000-4-2 Level 4 ESD Protection±17-kV Contact Discharge±17-kV Air Gap DischargeWithstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradationIEC 61000-4-4 EFT Protection80 A (5/50 ns)IEC 61000-4-5 Surge Protection2.5 A (8/20 µs)Low IO Capacitance0.1 pF (Typical) between IOs0.2 pF (Typical) IO to GNDDC Breakdown Voltage: 5.1 V (Minimum)Ultra Low Leakage Current: 10 nA (Maximum)Low ESD Clamping Voltage: 8.4 V at 5-A TLPSupports High Speed Interfaces that exceed 10 GbpsIndustrial Temperature Range: –40°C to +125°CType C Friendly Two Channel Flow-Through Routing PackagePin-out to suit symmetric differential high-speed signal routingTwo Different Package Options0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
Description
AI
The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).
This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.
The ESD122 is offered in two easy routing flow through packages.
The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).
This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.
The ESD122 is offered in two easy routing flow through packages.