
MCP6N11 Series
Manufacturer: Microchip Technology
SINGLE, INSTRUMENTATION AMP, MCAL, E TEMP 8 SOIC 3.90MM(.150IN) T/R ROHS COMPLIANT: YES
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Current - Supply | Mounting Type | Slew Rate | Output Type | Voltage - Supply Span (Max) | Gain Bandwidth Product | Current - Input Bias | Voltage - Input Offset | Number of Circuits | Voltage - Supply Span (Min) | Package Name | Amplifier Type | Package Length | Package Width | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 2.5 MHz | 10 pA | 850 µV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm | |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 1 MHz | 10 pA | 2 mV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm | |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 1 MHz | 10 pA | 2 mV | 1 | 1.8 V | 8-TDFN | Instrumentation | 2 mm | 3 mm | 8-WFDFN Exposed Pad |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 5 MHz | 10 pA | 500 µV | 1 | 1.8 V | 8-TDFN | Instrumentation | 2 mm | 3 mm | 8-WFDFN Exposed Pad |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 500 kHz | 10 pA | 3 mV | 1 | 1.8 V | 8-TDFN | Instrumentation | 2 mm | 3 mm | 8-WFDFN Exposed Pad |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 6 V/µs | Rail-to-Rail | 5.5 V | 35 MHz | 10 pA | 350 µV | 1 | 1.8 V | 8-TDFN | Instrumentation | 2 mm | 3 mm | 8-WFDFN Exposed Pad |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 5 MHz | 10 pA | 500 µV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm | |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 500 kHz | 10 pA | 3 mV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm | |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 5 MHz | 10 pA | 500 µV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm | |
Microchip Technology | 125 °C | -40 °C | 800 µA | Surface Mount | 9 V/µs | Rail-to-Rail | 5.5 V | 1 MHz | 10 pA | 2 mV | 1 | 1.8 V | 8-SOIC | Instrumentation | 0.154 in | 3.9 mm |