APF40 Series

Catalog

HEATSINK FORGED W/ADHESIVE TAPE

Part	Fin Height [z]	Fin Height [z]	Material Finish	Width [x]	Width [x]	Material	Package Cooled	Thermal Resistance @ Forced Air Flow	Shelf Life	Attachment Method	Type	Shape	Fin Height [z]
Tusonix a Subsidiary of CTS Electronic Components APF40-40-06CB/A01	6.35 mm	0.25 in	Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	3.3 °C/W	24 Months	Thermal Tape Adhesive (Included)	Top Mount	Fins Square
Tusonix a Subsidiary of CTS Electronic Components APF40-40-10CB	0.37 "		Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	2.5 °C/W 200 LFM		Thermal Tape Adhesive (Not Included)	Top Mount	Fins Square	9.4 mm
Tusonix a Subsidiary of CTS Electronic Components APF40-40-06CB	6.35 mm	0.25 in	Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	3.3 °C/W		Thermal Tape Adhesive (Not Included)	Top Mount	Fins Square
Tusonix a Subsidiary of CTS Electronic Components APF40-40-13CB	12.7 mm	0.5 in	Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	1.9 °C/W		Thermal Tape Adhesive (Not Included)	Top Mount	Fins Square
Tusonix a Subsidiary of CTS Electronic Components APF40-40-10CB/A01	0.37 "		Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	2.5 °C/W 200 LFM	24 Months	Thermal Tape Adhesive (Included)	Top Mount	Fins Square	9.4 mm
Tusonix a Subsidiary of CTS Electronic Components APF40-40-13CB/A01	12.7 mm	0.5 in	Black Anodized	1.575 in	40 mm	Aluminum	ASIC BGA CPU LGA	1.9 °C/W	24 Months	Thermal Tape Adhesive (Included)	Top Mount	Fins Square