APF40 Series

Catalog

HEATSINK FORGED W/ADHESIVE TAPE

Part	Shelf Life	Length	Type	Shape	Package Cooled	Material Finish	Thermal Resistance	Width	Attachment Method	Material	Fin Height
CTS Thermal Management Products APF40-40-06CB/A01	24 Months	1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	3.3 °C/W	1.575 in	Adhesive (Included) Thermal Tape	Aluminum	0.25 in
CTS Thermal Management Products APF40-40-10CB		1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	2.5 °C/W	1.575 in	Adhesive (Not Included) Thermal Tape	Aluminum	0.37 in
CTS Thermal Management Products APF40-40-06CB		1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	3.3 °C/W	1.575 in	Adhesive (Not Included) Thermal Tape	Aluminum	0.25 in
CTS Thermal Management Products APF40-40-13CB		1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	1.9 °C/W	1.575 in	Adhesive (Not Included) Thermal Tape	Aluminum	0.5 in
CTS Thermal Management Products APF40-40-10CB/A01	24 Months	1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	2.5 °C/W	1.575 in	Adhesive (Included) Thermal Tape	Aluminum	0.37 in
CTS Thermal Management Products APF40-40-13CB/A01	24 Months	1.575 in	Top Mount	Fins Square	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Black Anodized	1.9 °C/W	1.575 in	Adhesive (Included) Thermal Tape	Aluminum	0.5 in