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74ABT651 Series

Octal Bus Transceivers And Registers With 3-State Outputs

Manufacturer: Texas Instruments

Catalog(4 parts)

PartPackage / CasePackage / CasePackage / CaseOutput TypeOperating TemperatureOperating TemperatureLogic TypeCurrent - Output High, LowNumber of Bits per ElementNumber of ElementsMounting TypeSupplier Device PackageVoltage - SupplyVoltage - SupplyPackage / CasePackage / CasePackage / Case
Texas Instruments
SN74ABT651DWR
Transceiver, Inverting 1 Element 8 Bit per Element 3-State Output 24-SOIC
0.007499999832361937 m
0.007493000011891127 m
24-SOIC
3-State
85 °C
-40 °C
Inverting, Transceiver
0.03200000151991844 A, 0.06400000303983688 A
8 ul
1 ul
Surface Mount
24-SOIC
5.5 V
4.5 V
Texas Instruments
SN74ABT651DBRE4
Transceiver, Inverting 1 Element 8 Bit per Element 3-State Output 24-SSOP
24-SSOP
3-State
85 °C
-40 °C
Inverting, Transceiver
0.03200000151991844 A, 0.06400000303983688 A
8 ul
1 ul
Surface Mount
24-SSOP
5.5 V
4.5 V
0.005308600142598152 m
0.0052999998442828655 m
Texas Instruments
SN74ABT651DW
Transceiver, Inverting 1 Element 8 Bit per Element 3-State Output 24-SOIC
0.007499999832361937 m
0.007493000011891127 m
24-SOIC
3-State
85 °C
-40 °C
Inverting, Transceiver
0.03200000151991844 A, 0.06400000303983688 A
8 ul
1 ul
Surface Mount
24-SOIC
5.5 V
4.5 V
Texas Instruments
SN74ABT651NT
Transceiver, Inverting 1 Element 8 Bit per Element 3-State Output 24-PDIP
24-DIP
3-State
85 °C
-40 °C
Inverting, Transceiver
0.03200000151991844 A, 0.06400000303983688 A
8 ul
1 ul
Through Hole
24-PDIP
5.5 V
4.5 V
0.007619999814778566 m, 0.007619999814778566 m

Key Features

State-of-the-ArtEPIC-IIBTMBiCMOS Design Significantly Reduces Power DissipationESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)Latch-Up Performance Exceeds 500 mA Per JESD 17Typical VOLP(Output Ground Bounce) < 1 V at VCC= 5 V, TA= 25°CHigh-Drive Outputs (-32-mA IOH, 64-mA IOL)Multiplexed Real-Time and Stored DataInverting Data PathsPackage Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPsEPIC-IIB is a trademark of Texas Instruments Incorporated.State-of-the-ArtEPIC-IIBTMBiCMOS Design Significantly Reduces Power DissipationESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)Latch-Up Performance Exceeds 500 mA Per JESD 17Typical VOLP(Output Ground Bounce) < 1 V at VCC= 5 V, TA= 25°CHigh-Drive Outputs (-32-mA IOH, 64-mA IOL)Multiplexed Real-Time and Stored DataInverting Data PathsPackage Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPsEPIC-IIB is a trademark of Texas Instruments Incorporated.

Description

AI
These devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA\) inputs are provided to control the transceiver functions. The select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. A low input level selects real-time data, and a high input level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the 'ABT651 devices. Data on the A or B bus, or both, can be stored in the internal D flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it also is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA\. In this configuration, each output reinforces its input. When all the other data sources to the two sets of bus lines are at high impedance, each set remains at its last state. To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver (B to A). OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver (A to B). The SN54ABT651 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT651 is characterized for operation from -40°C to 85°C. The data output functions may be enabled or disabled by a variety of level combinations at OEAB or OEBA\. Data input functions are always enabled; i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs. When select control is low, clocks can occur simultaneously if allowances are made for propagation delays from A to B (B to A) plus setup and hold times. When select control is high, clocks must be staggered to load both registers. These devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA\) inputs are provided to control the transceiver functions. The select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. A low input level selects real-time data, and a high input level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the 'ABT651 devices. Data on the A or B bus, or both, can be stored in the internal D flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it also is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA\. In this configuration, each output reinforces its input. When all the other data sources to the two sets of bus lines are at high impedance, each set remains at its last state. To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver (B to A). OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver (A to B). The SN54ABT651 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT651 is characterized for operation from -40°C to 85°C. The data output functions may be enabled or disabled by a variety of level combinations at OEAB or OEBA\. Data input functions are always enabled; i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs. When select control is low, clocks can occur simultaneously if allowances are made for propagation delays from A to B (B to A) plus setup and hold times. When select control is high, clocks must be staggered to load both registers.