CSD96416 Series

50-A peak continuous current synchronous buck NexFET™ smart power stage

Catalog

50-A peak continuous current synchronous buck NexFET™ smart power stage

Part	Voltage - Supply	Fault Protection	Voltage - Load	Applications	Package Name	Package Length	Package Width	Features	Current - Output / Channel	Technology	Load Type	Package / Case	Current - Peak Output	Interface	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type
Texas Instruments CSD96416RWJ	16 V	Shoot-Through	25 V	Synchronous Buck Converters	41-VQFN-CLIP	5 mm	6 mm	Bootstrap Circuit	30 A	Power MOSFET	Inductive	41-PowerTFQFN	50 A	PWM	150 °C	-55 °C	Surface Mount
Texas Instruments CSD96416RWJT	16 V	Shoot-Through	25 V	Synchronous Buck Converters	41-VQFN-CLIP	5 mm	6 mm	Bootstrap Circuit	30 A	Power MOSFET	Inductive	41-PowerTFQFN	50 A	PWM	150 °C	-55 °C	Surface Mount

Catalog

50-A peak continuous current synchronous buck NexFET™ smart power stage

Description

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.