74LVC3G17 Series
3-ch, 1.65-V to 5.5-V buffers with Schmitt-Trigger inputs
Manufacturer: Texas Instruments
Catalog(4 parts)
Part | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Supplier Device Package | Number of Bits per Element▲▼ | Mounting Type | Output Type | Current - Output High, Low▲▼ | Current - Output High, Low▲▼ | Package / Case | Logic Type | Operating Temperature▲▼ | Operating Temperature▲▼ | Input Type | Package / Case▲▼ | Package / Case▲▼ |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments SN74LVC3G17YZPRBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-DSBGA | 5.5 V | 1.649999976158142 V | 8-DSBGA | 1 ul | Surface Mount | Push-Pull | 0.03200000151991844 A | 0.03200000151991844 A | 8-XFBGA, DSBGA | Buffer, Non-Inverting | 85 °C | -40 °C | Schmitt Trigger | ||
Texas Instruments SN74LVC3G17DCURG4Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-VSSOP | 5.5 V | 1.649999976158142 V | 1 ul | Surface Mount | Push-Pull | 0.03200000151991844 A | 0.03200000151991844 A | 8-VFSOP | Buffer, Non-Inverting | 125 °C | -40 °C | Schmitt Trigger | 0.002311399905011058 m | 0.002300000051036477 m | |
Texas Instruments SN74LVC3G17DCTRG4Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output SM8 | 5.5 V | 1.649999976158142 V | SM8 | 1 ul | Surface Mount | Push-Pull | 0.03200000151991844 A | 0.03200000151991844 A | Buffer, Non-Inverting | 125 °C | -40 °C | Schmitt Trigger | |||
Texas Instruments SN74LVC3G17DCTRBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output SM8 | 5.5 V | 1.649999976158142 V | SM8 | 1 ul | Surface Mount | Push-Pull | 0.03200000151991844 A | 0.03200000151991844 A | Buffer, Non-Inverting | 125 °C | -40 °C | Schmitt Trigger |
Key Features
• Available in the Texas InstrumentsNanoFree™ PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMaximum tpdof 5.4 ns at 3.3 VLow Power Consumption, 10-µA Maximum ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-DownMode and Back Drive ProtectionLatch-Up Performance Exceeds 100 mAPer JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas InstrumentsNanoFree™ PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMaximum tpdof 5.4 ns at 3.3 VLow Power Consumption, 10-µA Maximum ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-DownMode and Back Drive ProtectionLatch-Up Performance Exceeds 100 mAPer JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)
Description
AI
This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCCoperation.
The SN74LVC3G17 device contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCCoperation.
The SN74LVC3G17 device contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.