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66AK2L06 Series

Multicore DSP+ARM KeyStone II System-on-Chip (SoC)

Manufacturer: Texas Instruments

Catalog(4 parts)

PartClock RateSupplier Device PackagePackage / CaseTypeVoltage - I/OOperating TemperatureOperating TemperatureInterfaceOn-Chip RAMVoltage - CoreNon-Volatile MemoryMounting Type
Texas Instruments
66AK2L06XCMS2
1200000000 Hz
900-FCBGA (25x25)
900-BFBGA, FCBGA
DSP+ARM®
0.8500000238418579 V, 1 V, 1.7999999523162842 V, 3.299999952316284 V
0 °C
100 °C
DMA, EBI/EMI, Ethernet, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
45164264 b
Variable
3145728 b
Surface Mount
Texas Instruments
66AK2L06XCMS
900-FCBGA (25x25)
900-BFBGA, FCBGA
DSP+ARM®
0.8500000238418579 V, 1 V, 1.7999999523162842 V, 3.299999952316284 V
0 °C
100 °C
DMA, EBI/EMI, Ethernet, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
45164264 b
Variable
3145728 b
Surface Mount
Texas Instruments
66AK2L06XCMSA2
1200000000 Hz
900-FCBGA (25x25)
900-BFBGA, FCBGA
DSP+ARM®
0.8500000238418579 V, 1 V, 1.7999999523162842 V, 3.299999952316284 V
-40 °C
100 °C
DMA, EBI/EMI, Ethernet, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
45164264 b
Variable
3145728 b
Surface Mount
Texas Instruments
66AK2L06XCMSA
900-FCBGA (25x25)
900-BFBGA, FCBGA
DSP+ARM®
0.8500000238418579 V, 1 V, 1.7999999523162842 V, 3.299999952316284 V
-40 °C
100 °C
DMA, EBI/EMI, Ethernet, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
45164264 b
Variable
3145728 b
Surface Mount

Key Features

Four TMS320C66x DSP Core Subsystems (C66xCorePacs), Each With1.0 GHz or 1.2 GHz C66x Fixed/Floating-PointDSP Core38.4 GMacs/Core for Fixed Point @ 1.2 GHz19.2 GFlops/Core for Floating Point @ 1.2GHzMemory32K Byte L1P Per CorePac32K Byte L1D PerCorePac1024K Byte Local L2 Per CorePacARM CorePacTwo ARM®Cortex®-A15 MPCore™ Processorsat Up to 1.2 GHz1MB L2 Cache Memory Shared by Two ARMCoresFull Implementation of ARMv7-A ArchitectureInstruction Set32KB L1 Instruction and Data Caches per CoreAMBA 4.0 AXI Coherency Extension (ACE)Master Port, Connected to MSMC for LowLatency Access to Shared MSMC SRAMMulticore Shared Memory Controller (MSMC)2 MB SRAM Memory Shared by Four DSPCorePacs and One ARM CorePacMemory Protection Unit for Both MSM SRAMand DDR3_EMIFOn-chip Standalone RAM (OSR) - 1MB On-ChipSRAM for Additional Shared MemoryHardware CoprocessorsTwo Fast Fourier Transform CoprocessorsSupport Up to 1200 Msps at FFT Size 1024Support Max FFT Size 8192Multicore Navigator8k Multi-Purpose Hardware Queues with QueueManagerPacket-Based DMA for Zero-OverheadTransfersNetwork CoprocessorPacket Accelerator Enables Support for1 Gbps Wire Speed Throughput at 1.5MPackets Per SecondSecurity AcceleratorEngine Enables Support forIPSec, SRTP, and SSL/TLS SecurityECB, CBC, CTR, F8,CCM, GCM, HMAC,CMAC, GMAC, AES, DES, 3DES, SHA-1,SHA-2 (256-bit Hash), MD5Up to 6.4 Gbps IPSecEthernet SubsystemPeripheralsDigitalFront End (DFE) SubsystemSupport up to Four Lane JESD204A/B (7.37Gbps Line Rate Max.) Interface to MultipleData ConvertersIntegration of Digital Down/Up-Conversion(DDC/DUC) ModuleIQNet SubsystemTransporting data streams to an integratedDigital Front End (DFE)Two One-Lane PCIe Gen2 InterfacesSupports Up to 5 GBaudThree Enhanced Direct Memory Access (EDMA)Controllers72-Bit DDR3 Interface, Speeds Up to 1600 MHzEMIF16 InterfaceUSB 3.0 InterfaceUSIM InterfaceFour UART InterfacesThree I2C Interfaces64 GPIO PinsThree SPI InterfacesSemaphore ModuleFourteen 64-Bit TimersCommercial Case Temperature:0°C to 100°CExtended Case Temperature:–40°C to 100°CFour TMS320C66x DSP Core Subsystems (C66xCorePacs), Each With1.0 GHz or 1.2 GHz C66x Fixed/Floating-PointDSP Core38.4 GMacs/Core for Fixed Point @ 1.2 GHz19.2 GFlops/Core for Floating Point @ 1.2GHzMemory32K Byte L1P Per CorePac32K Byte L1D PerCorePac1024K Byte Local L2 Per CorePacARM CorePacTwo ARM®Cortex®-A15 MPCore™ Processorsat Up to 1.2 GHz1MB L2 Cache Memory Shared by Two ARMCoresFull Implementation of ARMv7-A ArchitectureInstruction Set32KB L1 Instruction and Data Caches per CoreAMBA 4.0 AXI Coherency Extension (ACE)Master Port, Connected to MSMC for LowLatency Access to Shared MSMC SRAMMulticore Shared Memory Controller (MSMC)2 MB SRAM Memory Shared by Four DSPCorePacs and One ARM CorePacMemory Protection Unit for Both MSM SRAMand DDR3_EMIFOn-chip Standalone RAM (OSR) - 1MB On-ChipSRAM for Additional Shared MemoryHardware CoprocessorsTwo Fast Fourier Transform CoprocessorsSupport Up to 1200 Msps at FFT Size 1024Support Max FFT Size 8192Multicore Navigator8k Multi-Purpose Hardware Queues with QueueManagerPacket-Based DMA for Zero-OverheadTransfersNetwork CoprocessorPacket Accelerator Enables Support for1 Gbps Wire Speed Throughput at 1.5MPackets Per SecondSecurity AcceleratorEngine Enables Support forIPSec, SRTP, and SSL/TLS SecurityECB, CBC, CTR, F8,CCM, GCM, HMAC,CMAC, GMAC, AES, DES, 3DES, SHA-1,SHA-2 (256-bit Hash), MD5Up to 6.4 Gbps IPSecEthernet SubsystemPeripheralsDigitalFront End (DFE) SubsystemSupport up to Four Lane JESD204A/B (7.37Gbps Line Rate Max.) Interface to MultipleData ConvertersIntegration of Digital Down/Up-Conversion(DDC/DUC) ModuleIQNet SubsystemTransporting data streams to an integratedDigital Front End (DFE)Two One-Lane PCIe Gen2 InterfacesSupports Up to 5 GBaudThree Enhanced Direct Memory Access (EDMA)Controllers72-Bit DDR3 Interface, Speeds Up to 1600 MHzEMIF16 InterfaceUSB 3.0 InterfaceUSIM InterfaceFour UART InterfacesThree I2C Interfaces64 GPIO PinsThree SPI InterfacesSemaphore ModuleFourteen 64-Bit TimersCommercial Case Temperature:0°C to 100°CExtended Case Temperature:–40°C to 100°C

Description

AI
The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing. TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling. The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor. TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing. The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources. TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse. The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution. The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing. TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling. The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor. TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing. The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources. TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse. The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution.