
66AK2L06 Series
Manufacturer: Texas Instruments
MULTICORE DSP+ARM KEYSTONE II SYSTEM-ON-CHIP (SOC)
| Part | Interface | USB Version | Operating Temperature (Min) | Operating Temperature (Max) | Voltage - Core | Mounting Type | Non-Volatile Memory Size | Non-Volatile Memory Type | On-Chip RAM | Type | Package / Case | Voltage - I/O (Option 4) | Voltage - I/O (Option 2) | Voltage - I/O (Option 1) | Voltage - I/O (Option 3) | Package Name | Package Length | Package Width | Clock Rate (Frequency) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB USIM | 3 | 0 °C | 100 °C | Variable | Surface Mount | 384 kB | ROM | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 3.3 V | 1 V | 0.85 V | 1.8 V | 900-FCBGA | 25 mm | 25 mm | 1.2 GHz |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB USIM | 3 | 0 °C | 100 °C | Variable | Surface Mount | 384 kB | ROM | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 3.3 V | 1 V | 0.85 V | 1.8 V | 900-FCBGA | 25 mm | 25 mm | 1 GHz |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB USIM | 3 | -40 °C | 100 °C | Variable | Surface Mount | 384 kB | ROM | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 3.3 V | 1 V | 0.85 V | 1.8 V | 900-FCBGA | 25 mm | 25 mm | 1.2 GHz |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB USIM | 3 | -40 °C | 100 °C | Variable | Surface Mount | 384 kB | ROM | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 3.3 V | 1 V | 0.85 V | 1.8 V | 900-FCBGA | 25 mm | 25 mm | 1 GHz |