SDL-101 Series

Catalog

CONN RCPT 2POS GOLD PCB

Part	Insulation Height	Connector Type	Contact Type	Contact Shape	Row Spacing - Mating	Insulation Color	Number of Positions Loaded	Insulation Material	Style	Mounting Type	Contact Length - Post	Contact Finish - Mating	Number of Positions	Contact Material	Termination	Fastening Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of Rows	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish Thickness - Post
Samtec Inc. SDL-101-T-12	0.095 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.095 in	Gold	2	Beryllium Copper	Solder	Push-Pull	125 °C	-55 °C	2	30 µin
Samtec Inc. SDL-101-TT-11	0.132 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.108 in	Tin	2	Beryllium Copper	Solder	Push-Pull	105 °C	-55 °C	2		Tin
Samtec Inc. SDL-101-T-11	0.132 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.108 in	Gold	2	Beryllium Copper	Solder	Push-Pull	125 °C	-55 °C	2	30 µin
Samtec Inc. SDL-101-T-10	0.122 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.108 in	Gold	2	Beryllium Copper	Solder	Push-Pull	125 °C	-55 °C	2	30 µin
Samtec Inc. SDL-101-TT-12	0.095 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.095 in	Tin	2	Beryllium Copper	Solder	Push-Pull	105 °C	-55 °C	2		Tin
Samtec Inc. SDL-101-G-12	0.095 in	Receptacle	Female Socket	Circular	0.1 in	Black	All	Liquid Crystal Polymer (LCP)	Board	Through Hole	0.095 in	Gold	2	Beryllium Copper	Solder	Push-Pull	125 °C	-55 °C	2	30 µin	Gold	10 µin