Beta
⌘K
CONN EDGE DUAL FMALE 20POS 0.031
| Part | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Gender | Features | Contact Material | Number of Positions/Bay/Row [custom] | Contact Finish Thickness | Contact Finish Thickness | Number of Rows | Color | Read Out | Card Type | Pitch [x] | Pitch [x] | Number of Positions | Contact Type | Mounting Type | Material - Insulation | Contact Finish | Card Thickness | Card Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.76 Ám | 30 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.093 in | 2.36 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.093 in | 2.36 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide Card Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.76 Ám | 30 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount Right Angle | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Board Guide Board Lock | Beryllium Copper | 10 | 0.76 Ám | 30 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |
Samtec Inc. | Solder | -55 °C | 125 °C | Female | Card Guides | Beryllium Copper | 10 | 0.25 Ám | 10 Áin | 2 | Black | Dual | Non Specified - Dual Edge | 0.8 mm | 0.031 in | 20 | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | Gold | 0.062 in | 1.57 mm |