CAP FILM 0.056UF 2% 50VDC 1812
| Part | Termination | Height - Seated (Max) [Max] | Height - Seated (Max) [Max] | Capacitance | Tolerance | Dielectric Material | Mounting Type | Voltage Rating - DC | Operating Temperature [Min] | Operating Temperature [Max] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Package / Case | Applications | Height - Seated (Max) [Max] [z] | Height - Seated (Max) [Max] [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KEMET | Solder Pads | 0.067 in | 1.7 mm | 0.056 µF | 2 % | Polyphenylene Sulfide (PPS) Metallized - Stacked | Surface Mount | 50 VDC | -55 °C | 125 °C | 0.185 " | 0.13 in | 4.7 mm | 3.3 mm | 1812 (4532 Metric) | General Purpose | ||
KEMET | Solder Pads | 100000 pF | 2 % | Polyphenylene Sulfide (PPS) Metallized - Stacked | Surface Mount | 50 VDC | -55 °C | 125 °C | 0.185 " | 0.13 in | 4.7 mm | 3.3 mm | 1812 (4532 Metric) | General Purpose | 2 mm | 0.079 in |