SMD CHIP RESISTOR, 1.5 OHM, ± 5%, 1 W, SMD, WIREWOUND, HIGH POWER
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Tolerance | Temperature Coefficient | Package / Case | Features | Number of Terminations | Height - Seated (Max) [Max] [z] | Height - Seated (Max) [Max] [z] | Size / Dimension [y] | Size / Dimension [x] | Composition | Power (Watts) | Supplier Device Package | Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bourns Inc. | 155 °C | -55 °C | 5 % | 50 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | |
Bourns Inc. | 155 °C | -55 °C | 5 % | 50 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 2.2 Ohms |
Bourns Inc. | 155 °C | -55 °C | 5 % | 20 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 20 Ohms |
Bourns Inc. | 155 °C | -55 °C | 5 % | 50 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 5 Ohms |
Bourns Inc. | 155 °C | -55 °C | 5 % | 20 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 24 Ohms |
Bourns Inc. | 155 °C | -55 °C | 1 % | 20 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 47 Ohms |
Bourns Inc. | 155 °C | -55 °C | 5 % | 50 ppm/°C | 3014 J-Lead | Current Sense Pulse Withstanding | 2 | 5.15 mm | 0.203 " | 0.138 in 3.5 mm | 0.295 " 7.5 mm | Wirewound | 1 W | 3014 | 2 Ohms |