74GTLP1394 Series
2-Bit LVTTL-to-GTLP Adj-Edge-Rate Bus Xcvr w/Split LVTTL Port, Feedback Path, & Selectable Polarity
Manufacturer: Texas Instruments
Catalog(5 parts)
Part | Supplier Device Package | Operating Temperature▲▼ | Operating Temperature▲▼ | Output Signal | Channel Type | Output Type | Channels per Circuit▲▼ | Mounting Type | Number of Circuits▲▼ | Translator Type | Package / Case▲▼ | Package / Case | Package / Case▲▼ | Input Signal | Package / Case▲▼ |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
16-TSSOP | 85 °C | -40 °C | GTLP | Bidirectional | Tri-State, Inverted | 2 ul | Surface Mount | 1 ul | Mixed Signal | 0.004394200164824724 m | 16-TSSOP | 0.004399999976158142 m | LVTTL | ||
16-TVSOP | 85 °C | -40 °C | GTLP | Bidirectional | Tri-State, Inverted | 2 ul | Surface Mount | 1 ul | Mixed Signal | 16-TFSOP | LVTTL | 0.004394200164824724 m, 0.004399999976158142 m | |||
Texas Instruments SN74GTLP1394RGYRMixed Signal Translator Bidirectional 1 Circuit 2 Channel 16-VQFN (4x3.5) | 16-VQFN (4x3.5) | 85 °C | -40 °C | GTLP | Bidirectional | Tri-State, Inverted | 2 ul | Surface Mount | 1 ul | Mixed Signal | 16-VFQFN Exposed Pad | LVTTL | |||
16-TSSOP | 85 °C | -40 °C | GTLP | Bidirectional | Tri-State, Inverted | 2 ul | Surface Mount | 1 ul | Mixed Signal | 0.004394200164824724 m | 16-TSSOP | 0.004399999976158142 m | LVTTL | ||
16-TVSOP | 85 °C | -40 °C | GTLP | Bidirectional | Tri-State, Inverted | 2 ul | Surface Mount | 1 ul | Mixed Signal | 16-TFSOP | LVTTL | 0.004394200164824724 m, 0.004399999976158142 m |
Key Features
• TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded BackplanesOEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic InterferenceBidirectional Interface Between GTLP Signal Levels and LVTTL Logic LevelsSplit LVTTL Port Provides a Feedback Path for Control and Diagnostics MonitoringLVTTL Interfaces Are 5-V TolerantHigh-Drive GTLP Outputs (100 mA)LVTTL Outputs (–24 mA/24 mA)Variable Edge-Rate Control (ERC\) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed LoadsIoff, Power-Up 3-State, and BIAS VCCSupport Live InsertionPolarity Control Selects True or Complementary OutputsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)OEC, TI, and TI-OPC are trademarks of Texas Instruments.TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded BackplanesOEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic InterferenceBidirectional Interface Between GTLP Signal Levels and LVTTL Logic LevelsSplit LVTTL Port Provides a Feedback Path for Control and Diagnostics MonitoringLVTTL Interfaces Are 5-V TolerantHigh-Drive GTLP Outputs (100 mA)LVTTL Outputs (–24 mA/24 mA)Variable Edge-Rate Control (ERC\) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed LoadsIoff, Power-Up 3-State, and BIAS VCCSupport Live InsertionPolarity Control Selects True or Complementary OutputsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)OEC, TI, and TI-OPC are trademarks of Texas Instruments.
Description
AI
The SN74GTLP1394 is a high-drive, 2-bit, 3-wire bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels, and is especially designed to work with the Texas Instruments 1394 backplane physical-layer controllers. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11.
GTLP is the TI derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1394 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels.
Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B port differential input reference voltage.
This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.
This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.
High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.
When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74GTLP1394 is a high-drive, 2-bit, 3-wire bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provides a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels, and is especially designed to work with the Texas Instruments 1394 backplane physical-layer controllers. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus-settling time and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 11.
GTLP is the TI derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1394 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT= 1.2 V and VREF= 0.8 V) or GTLP (VTT= 1.5 V and VREF= 1 V) signal levels.
Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREFis the B port differential input reference voltage.
This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCCcircuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.
This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.
High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC\). Changing the ERC\ input voltage between GND and VCCadjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.
When VCCis between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.