HEATSINK FOR 40MM BGA
| Part | Width [x] | Width [x] | Material | Attachment Method | Length | Length | Fin Height | Fin Height | Shape | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.525 in | 13.34 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.522 in | 13.27 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.525 in | 13.34 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.525 in | 13.34 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.525 in | 13.34 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |
Wakefield-Vette | 1.6 in | 40.64 mm | Aluminum | Thermal Tape Adhesive (Not Included) | 1.6 in | 40.64 mm | 0.525 in | 13.34 mm | Pin Fins Square | ASIC BGA CPU LGA | 2 °C/W | Black Anodized | Top Mount |