CSD95481RWJ Series

60A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint

Catalog

60A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint

Part	Current - Output / Channel	Technology	Load Type	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Applications	Voltage - Load (Max)	Voltage - Load (Min)	Interface	Fault Protection	Package Name	Package Length	Package Width	Package / Case	Features	Current - Peak Output	Half-Bridge Count	Output Configuration
Texas Instruments CSD95481RWJT	60 A	Power MOSFET	Capacitive Inductive	Surface Mount	125 °C	-40 °C	5.5 V	4.5 V	Synchronous Buck Converters	16 V	4.5 V	PWM	Shoot-Through	41-VQFN-CLIP	5 mm	6 mm	41-PowerTFQFN	Bootstrap Circuit	90 A	3	Half-Bridge
Texas Instruments CSD95481RWJ	60 A	Power MOSFET	Capacitive Inductive	Surface Mount	125 °C	-40 °C	5.5 V	4.5 V	Synchronous Buck Converters	16 V	4.5 V	PWM	Shoot-Through	41-VQFN-CLIP	5 mm	6 mm	41-PowerTFQFN	Bootstrap Circuit	90 A	3	Half-Bridge

Catalog

60A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint

Description

The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.