ESQT-114 Series
Manufacturer: Samtec Inc.
CONN SOCKET 28POS 0.079 GOLD PCB
| Part | Contact Finish - Mating | Contact Finish - Post | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Length - Post | Termination | Connector Type | Current Rating (Per Contact) | Style | Insulation Height | Number of Positions Loaded | Insulation Color | Mounting Type | Number of Rows | Number of Positions | Row Spacing - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Mating | Contact Type | Fastening Type | Contact Shape | Insulation Material | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Tin | UL94 V-0 | 20 Ąin | 0.11 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.348 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Tin | UL94 V-0 | 10 µin | 0.1 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.75 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Tin | UL94 V-0 | 3 µin | 0.541 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.309 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Tin | UL94 V-0 | 3 µin | 0.143 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.315 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Tin | UL94 V-0 | 10 µin | 0.259 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.591 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Gold | UL94 V-0 | 20 Ąin | 0.235 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.615 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | 3 µin |
Samtec Inc. | Gold | Tin | UL94 V-0 | 3 µin | 0.457 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.393 in | All | Black | Through Hole | 3 | 42 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Gold | UL94 V-0 | 20 Ąin | 0.286 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.564 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | 3 µin |
Samtec Inc. | Gold | Tin | UL94 V-0 | 3 µin | 0.338 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.512 in | All | Black | Through Hole | 2 | 28 | 0.079 in | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Gold | Tin | UL94 V-0 | 3 µin | 0.06 in | Solder | Elevated Socket | 4.5 A | Board Board or Cable | 0.79 in | All | Black | Through Hole | 1 | 14 | 125 °C | -55 °C | 0.079 in | Forked | Push-Pull | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |