ESQT-114-02-F-D-309
ActiveSamtec Inc.
CONN ELEVATED SOCKET SKT 28 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER
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ESQT-114-02-F-D-309
ActiveSamtec Inc.
CONN ELEVATED SOCKET SKT 28 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER
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Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-114-02-F-D-309 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 3 µin |
| Contact Finish Thickness - Mating | 0.076 µm |
| Contact Length - Post | 0.541 in |
| Contact Length - Post | 13.74 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.309 in |
| Insulation Height | 7.85 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 28 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
ESQT-114 Series
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| Part | Contact Shape | Style | Contact Material | Fastening Type | Number of Rows | Insulation Height | Insulation Height | Row Spacing - Mating | Row Spacing - Mating | Number of Positions Loaded | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Insulation Material | Number of Positions | Insulation Color | Material Flammability Rating | Contact Finish - Mating | Termination | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Type | Pitch - Mating [x] | Pitch - Mating [x] | Connector Type | Contact Length - Post [x] | Contact Length - Post | Contact Finish - Post | Contact Length - Post | Contact Length - Post [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 8.84 mm | 0.348 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.51 µm | 20 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 0.11 in | 2.79 mm | Tin | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 19.05 mm | 0.75 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.25 çm | 10 çin | Forked | 0.079 in | 2 mm | Elevated Socket | 2.54 mm | Tin | 0.1 in | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 7.85 mm | 0.309 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.076 µm | 3 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 13.74 mm | Tin | 0.541 in | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 1 | 13.97 mm | 0.55 in | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 14 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.076 µm | 3 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 0.3 " | Tin | 7.62 mm | ||||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 8 mm | 0.315 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.076 µm | 3 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 0.143 in | Tin | 3.63 mm | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 15 mm | 0.591 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.25 çm | 10 çin | Forked | 0.079 in | 2 mm | Elevated Socket | 0.259 in | Tin | 6.58 mm | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 15.62 mm | 0.615 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.51 µm | 20 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 0.235 in | 5.97 mm | Gold | 3 µin | 0.076 µm | ||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 3 | 9.98 mm | 0.393 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 42 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.076 µm | 3 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 11.61 mm | Tin | 0.457 in | ||||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 14.33 mm | 0.564 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.51 µm | 20 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 7.26 mm | Gold | 0.286 " | 3 µin | 0.076 µm | ||
Samtec Inc. | Square | Board to Board Cable | Phosphor Bronze | Push-Pull | 2 | 13 mm | 0.512 in | 0.079 in | 2 mm | All | -55 °C | 125 °C | 4.5 A | Liquid Crystal Polymer (LCP) | 28 | Black | UL94 V-0 | Gold | Solder | Through Hole | 0.076 µm | 3 µin | Forked | 0.079 in | 2 mm | Elevated Socket | 8.59 mm | Tin | 0.338 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 9.00 | |
Description
General part information
ESQT-114 Series
28 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources
No documents available