XG4C Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN HEADER R/A 30POS 2.54MM

Part	Pitch - Mating	Pitch - Mating	Features	Insulation Height	Insulation Height	Operating Temperature [Max]	Operating Temperature [Min]	Connector Type	Insulation Color	Mounting Type	Contact Length - Mating	Contact Length - Mating [x]	Contact Length - Post	Contact Length - Post [x]	Material Flammability Rating	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Number of Positions	Contact Shape	Number of Rows	Insulation Material	Contact Finish - Post	Shrouding	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Voltage Rating	Contact Finish - Mating	Fastening Type	Contact Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Style	Number of Positions Loaded	Termination	Mated Stacking Heights	Overall Contact Length	Overall Contact Length
Omron Electronics Inc-EMC Div XG4C-3034	0.1 in	2.54 mm	Keying Slot	8.2 mm	0.323 in	105 ░C	-55 °C	Header	Black	Through Hole, Right Angle	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	30	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder
Omron Electronics Inc-EMC Div XG4C-6031	0.1 in	2.54 mm	Keying Slot	8.51 mm	0.335 "	105 ░C	-55 °C	Header	Black	Through Hole	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	60	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder	10.1 mm, 19 mm, 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-4034	0.1 in	2.54 mm	Keying Slot	8.2 mm	0.323 in	105 ░C	-55 °C	Header	Black	Through Hole, Right Angle	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	40	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder
Omron Electronics Inc-EMC Div XG4C-5031	0.1 in	2.54 mm	Keying Slot	8.51 mm	0.335 "	105 ░C	-55 °C	Header	Black	Through Hole	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	50	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder	10.1 mm, 19 mm, 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-3031	0.1 in	2.54 mm	Keying Slot	8.51 mm	0.335 "	105 ░C	-55 °C	Header	Black	Through Hole	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	30	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder	10.1 mm, 19 mm, 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-6474	0.1 in	2.54 mm	Keying Slot	8.2 mm	0.323 in	105 ░C	-55 °C	Header	Black	Through Hole, Right Angle	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	64	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder
Omron Electronics Inc-EMC Div XG4C-6074	0.1 in	2.54 mm	Keying Slot	8.2 mm	0.323 in	105 ░C	-55 °C	Header	Black	Through Hole, Right Angle	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	60	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder
Omron Electronics Inc-EMC Div XG4C-5014	0.1 in	2.54 mm				105 ░C	-55 °C	Header	Black						UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	50	Square		Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass	2 çm	78.7 çin	Board to Board, Cable		Solder
Omron Electronics Inc-EMC Div XG4C-5071	0.1 in	2.54 mm	Keying Slot	8.51 mm	0.335 "	105 ░C	-55 °C	Header	Black	Through Hole	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	50	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder	10.1 mm, 19 mm, 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-1074	0.1 in	2.54 mm	Keying Slot	8.2 mm	0.323 in	105 ░C	-55 °C	Header	Black	Through Hole, Right Angle	6.1 mm	0.24 in	3.2 mm	0.126 in	UL94 V-0	Male Pin	0.15 µm	5.9 µin	3 A	10	Square	2	Polybutylene Terephthalate (PBT), Glass Filled	Tin	Shrouded - 4 Wall	2.54 mm	0.1 in	300 VDC	Gold	Push-Pull	Brass, Nickel	2 çm	78.7 çin	Board to Board, Cable	All	Solder