BKT-113 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 13POS 1MM
| Part | Current Rating (Per Contact) | Features | Insulation Height | Row Spacing - Mating | Fastening Type | Number of Positions Loaded | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material | Contact Finish - Post | Number of Rows | Termination | Contact Length - Mating | Insulation Color | Contact Shape | Insulation Material | Pitch - Mating | Number of Positions | Connector Type | Operating Temperature (Max) | Operating Temperature (Min) | Style | Contact Type | Shrouding | Mated Stacking Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2.8 A | Board Guide | 0.098 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 5 mm |
Samtec Inc. | 2.8 A | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 3 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.5 mm | |
Samtec Inc. | 2.8 A | Board Guide | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.5 mm |
Samtec Inc. | 2.8 A | Pick and Place | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 3 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.14 mm |
Samtec Inc. | 2.8 A | Board Guide | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.14 mm |
Samtec Inc. | 2.8 A | Pick and Place | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.14 mm |
Samtec Inc. | 2.8 A | 0.137 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 6 mm | |
Samtec Inc. | 2.8 A | Pick and Place | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 3 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.14 mm |
Samtec Inc. | 2.8 A | Pick and Place | 0.064 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 10 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 4.5 mm |
Samtec Inc. | 2.8 A | Board Guide | 0.137 in | 0.1 in | Push-Pull | All | UL94 V-0 | Surface Mount | Gold | 3 µin | Phosphor Bronze | Tin | 2 | Solder | 0.065 in | Black | Square | Liquid Crystal Polymer (LCP) | 0.039 in | 13 | Header | 125 °C | -55 °C | Board | Male Pin | Unshrouded | 6 mm |