74AUP3G17 Series
3-ch, 0.8-V to 3.6-V low power buffers with Schmitt-Trigger inputs
Manufacturer: Texas Instruments
Catalog(4 parts)
| Part | Current - Output High, Low▲▼ | Mounting Type | Operating Temperature▲▼ | Operating Temperature▲▼ | Number of Bits per Element▲▼ | Input Type | Output Type | Logic Type | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Package / Case▲▼ | Package / Case | Package / Case▲▼ | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments SN74AUP3G17DCURBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-VSSOP | 0.004000000189989805 A, 0.004000000189989805 A | Surface Mount | 85 °C | -40 °C | 1 ul | Schmitt Trigger | Push-Pull | Buffer, Non-Inverting | 3.5999999046325684 V | 0.800000011920929 V | 0.002311399905011058 m | 8-VFSOP | 0.002300000051036477 m | |
Texas Instruments SN74AUP3G17YFPRBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-DSBGA | 0.004000000189989805 A, 0.004000000189989805 A | Surface Mount | 85 °C | -40 °C | 1 ul | Schmitt Trigger | Push-Pull | Buffer, Non-Inverting | 3.5999999046325684 V | 0.800000011920929 V | 8-XFBGA, DSBGA | 8-DSBGA | ||
Texas Instruments SN74AUP3G17DQERBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-X2SON (1.4x1) | 0.004000000189989805 A, 0.004000000189989805 A | Surface Mount | 85 °C | -40 °C | 1 ul | Schmitt Trigger | Push-Pull | Buffer, Non-Inverting | 3.5999999046325684 V | 0.800000011920929 V | 8-XFDFN | 8-X2SON (1.4x1) | ||
Texas Instruments SN74AUP3G17RSERBuffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-UQFN (1.5x1.5) | 0.004000000189989805 A, 0.004000000189989805 A | Surface Mount | 85 °C | -40 °C | 1 ul | Schmitt Trigger | Push-Pull | Buffer, Non-Inverting | 3.5999999046325684 V | 0.800000011920929 V | 8-UFQFN | 8-UQFN (1.5x1.5) |
Key Features
• Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption (ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption (Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise — Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 5.1 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar Is a trademark of Texas InstrumentsAvailable in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption (ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption (Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise — Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 5.1 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar Is a trademark of Texas Instruments
Description
AI
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.
The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.
The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.