UC3610 Series
Dual schottky diode bridge with 3-A peak forward current
Manufacturer: Texas Instruments
Catalog(1 parts)
| Part | Voltage - Peak Reverse (Max)▲▼ | Current - Reverse Leakage @ Vr▲▼ | Mounting Type | Diode Type | Voltage - Forward (Vf) (Max) @ If▲▼ | Current - Average Rectified (Io)▲▼ | Package / Case | Technology | Operating Temperature▲▼ | Operating Temperature▲▼ | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|
50 V | 0.00009999999747378752 A | Surface Mount | Single Phase | 1.2999999523162842 V | 3 A | 16-SOIC | Schottky | 70 °C | 0 °C | 16-SOIC |
Key Features
• Monolithic Eight-Diode ArrayExceptional EfficiencyLow Forward VoltageFast Recovery TimeHigh Peak CurrentSmall SizeMonolithic Eight-Diode ArrayExceptional EfficiencyLow Forward VoltageFast Recovery TimeHigh Peak CurrentSmall Size
Description
AI
This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.
The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.
This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.
This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.
The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.
This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.