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74LVTH16501 Series

3.3-V ABT 18-Bit Universal Bus Transceivers With 3-State Outputs

Manufacturer: Texas Instruments

Catalog(4 parts)

PartPackage / CasePackage / CasePackage / CaseMounting TypeNumber of CircuitsVoltage - SupplyVoltage - SupplyCurrent - Output High, LowSupplier Device PackageOperating TemperatureOperating TemperaturePackage / CasePackage / Case
Texas Instruments
SN74LVTH16501DGGR
Universal Bus Transceiver 18-Bit 56-TSSOP
56-TFSOP
0.006099999882280827 m
0.006095999851822853 m
Surface Mount
18-Bit
2.700000047683716 V
3.5999999046325684 V
0.03200000151991844 A, 0.06400000303983688 A
56-TSSOP
-40 °C
85 °C
Texas Instruments
SN74LVTH16501DLG4
Universal Bus Transceiver 18-Bit 56-SSOP
56-BSSOP
Surface Mount
18-Bit
2.700000047683716 V
3.5999999046325684 V
0.03200000151991844 A, 0.06400000303983688 A
56-SSOP
-40 °C
85 °C
0.007493000011891127 m
0.007499999832361937 m
Texas Instruments
SN74LVTH16501DLR
Universal Bus Transceiver 18-Bit 56-SSOP
56-BSSOP
Surface Mount
18-Bit
2.700000047683716 V
3.5999999046325684 V
0.03200000151991844 A, 0.06400000303983688 A
56-SSOP
-40 °C
85 °C
0.007493000011891127 m
0.007499999832361937 m
Texas Instruments
74LVTH16501DLRG4
Universal Bus Transceiver 18-Bit 56-SSOP
56-BSSOP
Surface Mount
18-Bit
2.700000047683716 V
3.5999999046325684 V
0.03200000151991844 A, 0.06400000303983688 A
56-SSOP
-40 °C
85 °C
0.007493000011891127 m
0.007499999832361937 m

Key Features

Members of the Texas InstrumentsWidebus™ FamilyUBT™ Transceiver Combines D-TypeLatches and D-Type Flip-Flops forOperation in Transparent, Latched, orClocked ModeState-of-the-Art Advanced BiCMOSTechnology (ABT) Design for 3.3-VOperation and Low Static-PowerDissipationSupport Mixed-Mode Signal Operation (5-VInput and Output Voltages With 3.3-V VCC)Support Unregulated Battery OperationDown to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support HotInsertionBus Hold on Data Inputs Eliminates theNeed for External Pullup/PulldownResistorsDistributed VCCand GND Pins MinimizeHigh-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Widebus and UBT are trademarks of Texas Instruments.Members of the Texas InstrumentsWidebus™ FamilyUBT™ Transceiver Combines D-TypeLatches and D-Type Flip-Flops forOperation in Transparent, Latched, orClocked ModeState-of-the-Art Advanced BiCMOSTechnology (ABT) Design for 3.3-VOperation and Low Static-PowerDissipationSupport Mixed-Mode Signal Operation (5-VInput and Output Voltages With 3.3-V VCC)Support Unregulated Battery OperationDown to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support HotInsertionBus Hold on Data Inputs Eliminates theNeed for External Pullup/PulldownResistorsDistributed VCCand GND Pins MinimizeHigh-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Widebus and UBT are trademarks of Texas Instruments.

Description

AI
The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. Data flow in each direction is controlled by output-enable (OEAB andOEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but usesOEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high andOEBAis active low). Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V,OEshould be tied to VCCthrough a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. Data flow in each direction is controlled by output-enable (OEAB andOEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but usesOEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high andOEBAis active low). Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V,OEshould be tied to VCCthrough a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.