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TRANS IGBT CHIP N-CH 650V 3-PIN DIE WAFER
| Part | Package / Case | Operating Temperature [Min] | Operating Temperature [Max] | Current - Collector (Ic) (Max) [Max] | Supplier Device Package | Vce(on) (Max) @ Vge, Ic | Current - Collector Pulsed (Icm) | IGBT Type | Mounting Type | Voltage - Collector Emitter Breakdown (Max) |
|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | Die | -40 C | 175 °C | 75 A | Die | 2.22 V | 225 A | Trench Field Stop | Surface Mount | 650 V |