CC2560 Series

Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)

Catalog

Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)

Part	Data Rate (Max)	Operating Temperature (Min)	Operating Temperature (Max)	RF Family/Standard	Frequency	Protocol	Package / Case	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Sensitivity	Serial Interfaces	Type	Package Name	Package Width	Package Length	Modulation	Current - Receiving (Min)	Current - Receiving (Max)	Current - Transmitting (Min)	Current - Transmitting (Max)	Mounting Type	Power - Output	Current - Transmitting	Current - Receiving
Texas Instruments CC2560ANPYFVR	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560ANYFVT	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560BYFVT	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.1	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560ARVMT	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	76-VQFN Dual Rows Exposed Pad	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	76-VQFNP-MR	8 mm	8 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560ARVMR	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	76-VQFN Dual Rows Exposed Pad	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	76-VQFNP-MR	8 mm	8 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560AYFVR	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560ANPYFVT	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.0	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560BRVMR	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.1	76-VQFN Dual Rows Exposed Pad	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	76-VQFNP-MR	8 mm	8 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560BYFVR	4 MBaud	-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.1	54-UFBGA DSBGA	4.8 V	2.2 V	-95 dBm	I2S UART	TxRx Only	54-DSBGA	3.27 mm	2.93 mm	GFSK GMSK	40.5 mA	41.2 mA	40.5 mA	41.2 mA	Surface Mount	12 dBm
Texas Instruments CC2560BRVMT		-40 °C	85 °C	Bluetooth	2.4 GHz	Bluetooth v4.1	76-VQFN Dual Rows Exposed Pad	4.8 V	2.2 V	-95 dBm	UART	TxRx + MCU	76-VQFNP-MR	8 mm	8 mm	GFSK					Surface Mount	10 dBm	112.5 mA	13.7 mA

Catalog

Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)

Description

The TI CC256x device is a completeBluetoothBR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generationBluetoothcore, the CC256x device provides a product-proven solution that isBluetooth4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to otherBluetoothLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly usedBluetoothBR/EDR/LE modes of operation. The TI Dual-ModeBluetoothStack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following: In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a newBluetoothaudio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions. The TI CC256x device is a completeBluetoothBR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generationBluetoothcore, the CC256x device provides a product-proven solution that isBluetooth4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to otherBluetoothLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly usedBluetoothBR/EDR/LE modes of operation. The TI Dual-ModeBluetoothStack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following: In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a newBluetoothaudio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.