THS6062 Series

Low-Noise ADSL Dual Differential Receiver

Catalog

Low-Noise ADSL Dual Differential Receiver

Part	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Package Name	Number of Receivers	Operating Temperature (Max)	Operating Temperature (Min)	Protocol	Mounting Type	Type	Package Length	Package Features	Package Width	Duplex
Texas Instruments THS6062CDGN	15 V	5 V	8-HVSSOP 8-MSOP 8-TSSOP	2	70 °C	0 °C	DSL	Surface Mount	Receiver	0.118 in	Exposed Pad	3 mm
Texas Instruments THS6062IDGNR	15 V	5 V	8-HVSSOP 8-MSOP 8-TSSOP	2	85 °C	-40 °C	DSL	Surface Mount	Receiver	0.118 in	Exposed Pad	3 mm	Full
Texas Instruments THS6062CDGNR	15 V	5 V	8-HVSSOP 8-MSOP 8-TSSOP	2	70 °C	0 °C	DSL	Surface Mount	Receiver	0.118 in	Exposed Pad	3 mm
Texas Instruments THS6062CD	15 V	5 V	8-SOIC	2	70 °C	0 °C	DSL	Surface Mount	Receiver	0.154 in		3.9 mm
Texas Instruments THS6062ID	15 V	5 V	8-SOIC	2	85 °C	-40 °C	DSL	Surface Mount	Receiver	0.154 in		3.9 mm	Full

Catalog

Low-Noise ADSL Dual Differential Receiver

Description

The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures. The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures.