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CONN IC DIP SOCKET 40POS TIN
| Part | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Material - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Type | Type | Type | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Post | Pitch - Post | Contact Finish - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Termination | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | 40 | 20 | 2 | Surface Mount | DIP | 0.6 in | 15.24 mm | -55 °C | 125 °C | 2.54 mm | 0.1 in | Tin | Open Frame | 30 Áin | 0.76 Ám | Liquid Crystal Polymer (LCP) | Solder | Gold |