OMAPL137 Series
Low power C674x floating-point DSP + Arm9 processor - up to 456 MHz
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
Low power C674x floating-point DSP + Arm9 processor - up to 456 MHz
Part | Speed | Voltage - I/O | Display & Interface Controllers | Graphics Acceleration | Package / Case | Supplier Device Package | USB | Number of Cores/Bus Width | Co-Processors/DSP | Mounting Type | Core Processor | Operating Temperature [Min] | Operating Temperature [Max] | Ethernet | Additional Interfaces |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments OMAPL137BZKBA3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 105 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137DZKBD4 | 456 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137DZKB3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137CZKBA3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 105 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137BZKB3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137CZKB4 | 456 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137BZKB4 | 456 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137BZKBD4 | 456 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137AZKB3 | 300 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137DZKBT3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 125 ¯C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137CZKB3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137BPTPH | 300 MHz | 1.8 V, 3.3 V | LCD | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -55 °C | 175 ░C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137BZKBT3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 125 ¯C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137DZKB4 | 456 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | 0 °C | 90 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137CZKBT3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 125 ¯C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | |
Texas Instruments OMAPL137DZKBA3 | 375 MHz | 1.8 V, 3.3 V | LCD | 256-BGA | 256-BGA (17x17) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1 Core, 32 Bit | C674x, CP15 | Surface Mount | ARM926EJ-S | -40 °C | 105 °C | 10/100Mbps (1) | HPI, I2C, McASP, MMC/SD, SPI, UART |
Key Features
• Software SupportTI DSP/BIOSChip Support Library and DSP LibraryDual Core SoC375- and 456-MHz ARM926EJ-S RISC MPU375- and 456-MHz C674x VLIW DSPARM926EJ-S Core32-Bit and 16-Bit (Thumb®) InstructionsDSP Instruction ExtensionsSingle Cycle MACARM® Jazelle® TechnologyEmbedded ICE-RT™ for Real-Time DebugARM9™ Memory Architecture16KB of Instruction Cache16KB of Data Cache8KB of RAM (Vector Table)64KB of ROMC674x Instruction Set FeaturesSuperset of the C67x+ and C64x+ ISAsUp to 3648 MIPS and 2736 MFLOPS C674xByte-Addressable (8-, 16-, 32-, and 64-Bit Data)8-Bit Overflow ProtectionBit-Field Extract, Set, ClearNormalization, Saturation, Bit-CountingCompact 16-Bit InstructionsC674x Two-Level Cache Memory Architecture32KB of L1P Program RAM/Cache32KB of L1D Data RAM/Cache256KB of L2 Unified Mapped RAM/CacheFlexible RAM/Cache Partition (L1 and L2)Enhanced Direct Memory Access Controller 3 (EDMA3):2 Transfer Controllers32 Independent DMA Channels8 Quick DMA ChannelsProgrammable Transfer Burst SizeTMS320C674x Fixed- and Floating-Point VLIW DSP CoreLoad-Store Architecture with Nonaligned Support64 General-Purpose Registers (32-Bit)Six ALU (32- and 40-Bit) Functional UnitsSupports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating PointSupports up to Four SP Additions Per Clock, Four DP Additions Every 2 ClocksSupports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per CycleTwo Multiply Functional UnitsMixed-Precision IEEE Floating Point Multiply Supported up to:2 SP x SP -> SP Per Clock2 SP x SP -> DP Every Two Clocks2 SP x DP -> DP Every Three Clocks2 DP x DP -> DP Every Four ClocksFixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex MultiplesInstruction Packing Reduces Code SizeAll Instructions ConditionalHardware Support for Modulo LoopOperationProtected Mode OperationExceptions Support for Error Detection and Program Redirection128KB of RAM Shared Memory3.3-V LVCMOS I/Os (Except for USB Interfaces)Two External Memory Interfaces:EMIFANOR (8- or 16-Bit-Wide Data)NAND (8- or 16-Bit-Wide Data)16-Bit SDRAM with 128-MB Address SpaceEMIFB32-Bit or 16-Bit SDRAM with 256-MB Address SpaceThree Configurable 16550-Type UART Modules:UART0 with Modem Control SignalsAutoflow Control Signals (CTS, RTS) on UART0 Only16-Byte FIFO16x or 13x Oversampling OptionLCD ControllerTwo Serial Peripheral Interfaces (SPIs) Each with One Chip SelectMultimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)Two Master and Slave Inter-Integrated Circuit (I2C Bus™)One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High BandwidthProgrammable Real-Time Unit Subsystem (PRUSS)Two Independent Programmable Realtime Unit (PRU) Cores32-Bit Load and Store RISC Architecture4KB of Instruction RAM per Core512 Bytes of Data RAM per CorePRUSS can be Disabled via Software to Save PowerStandard Power-Management MechanismClock GatingEntire Subsystem Under a Single PSC Clock Gating DomainDedicated Interrupt ControllerDedicated Switched Central ResourceUSB 1.1 OHCI (Host) with Integrated PHY (USB1)USB 2.0 OTG Port with Integrated PHY (USB0)USB 2.0 High- and Full-Speed ClientUSB 2.0 High-, Full-, and Low-Speed HostEnd Point 0 (Control)End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TXThree Multichannel Audio Serial Ports (McASPs):Six Clock Zones and 28 Serial Data PinsSupports TDM, I2S, and Similar FormatsDIT-Capable (McASP2)FIFO Buffers for Transmit and Receive10/100 Mbps Ethernet MAC (EMAC):IEEE 802.3 Compliant (3.3-V I/O Only)RMII Media-Independent InterfaceManagement Data I/O (MDIO) ModuleReal-Time Clock with 32-kHz Oscillator and Separate Power RailOne 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)Three Enhanced Pulse Width Modulators (eHRPWMs):Dedicated 16-Bit Time-Base Counter with Period and Frequency Control6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric OutputsDead-Band GenerationPWM Chopping by High-Frequency CarrierTrip Zone InputThree 32-Bit Enhanced Capture (eCAP) Modules:Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) OutputsSingle-Shot Capture of up to Four Event Time-StampsTwo 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball PitchCommercial, Industrial, Extended, or Automotive TemperatureSoftware SupportTI DSP/BIOSChip Support Library and DSP LibraryDual Core SoC375- and 456-MHz ARM926EJ-S RISC MPU375- and 456-MHz C674x VLIW DSPARM926EJ-S Core32-Bit and 16-Bit (Thumb®) InstructionsDSP Instruction ExtensionsSingle Cycle MACARM® Jazelle® TechnologyEmbedded ICE-RT™ for Real-Time DebugARM9™ Memory Architecture16KB of Instruction Cache16KB of Data Cache8KB of RAM (Vector Table)64KB of ROMC674x Instruction Set FeaturesSuperset of the C67x+ and C64x+ ISAsUp to 3648 MIPS and 2736 MFLOPS C674xByte-Addressable (8-, 16-, 32-, and 64-Bit Data)8-Bit Overflow ProtectionBit-Field Extract, Set, ClearNormalization, Saturation, Bit-CountingCompact 16-Bit InstructionsC674x Two-Level Cache Memory Architecture32KB of L1P Program RAM/Cache32KB of L1D Data RAM/Cache256KB of L2 Unified Mapped RAM/CacheFlexible RAM/Cache Partition (L1 and L2)Enhanced Direct Memory Access Controller 3 (EDMA3):2 Transfer Controllers32 Independent DMA Channels8 Quick DMA ChannelsProgrammable Transfer Burst SizeTMS320C674x Fixed- and Floating-Point VLIW DSP CoreLoad-Store Architecture with Nonaligned Support64 General-Purpose Registers (32-Bit)Six ALU (32- and 40-Bit) Functional UnitsSupports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating PointSupports up to Four SP Additions Per Clock, Four DP Additions Every 2 ClocksSupports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per CycleTwo Multiply Functional UnitsMixed-Precision IEEE Floating Point Multiply Supported up to:2 SP x SP -> SP Per Clock2 SP x SP -> DP Every Two Clocks2 SP x DP -> DP Every Three Clocks2 DP x DP -> DP Every Four ClocksFixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex MultiplesInstruction Packing Reduces Code SizeAll Instructions ConditionalHardware Support for Modulo LoopOperationProtected Mode OperationExceptions Support for Error Detection and Program Redirection128KB of RAM Shared Memory3.3-V LVCMOS I/Os (Except for USB Interfaces)Two External Memory Interfaces:EMIFANOR (8- or 16-Bit-Wide Data)NAND (8- or 16-Bit-Wide Data)16-Bit SDRAM with 128-MB Address SpaceEMIFB32-Bit or 16-Bit SDRAM with 256-MB Address SpaceThree Configurable 16550-Type UART Modules:UART0 with Modem Control SignalsAutoflow Control Signals (CTS, RTS) on UART0 Only16-Byte FIFO16x or 13x Oversampling OptionLCD ControllerTwo Serial Peripheral Interfaces (SPIs) Each with One Chip SelectMultimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)Two Master and Slave Inter-Integrated Circuit (I2C Bus™)One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High BandwidthProgrammable Real-Time Unit Subsystem (PRUSS)Two Independent Programmable Realtime Unit (PRU) Cores32-Bit Load and Store RISC Architecture4KB of Instruction RAM per Core512 Bytes of Data RAM per CorePRUSS can be Disabled via Software to Save PowerStandard Power-Management MechanismClock GatingEntire Subsystem Under a Single PSC Clock Gating DomainDedicated Interrupt ControllerDedicated Switched Central ResourceUSB 1.1 OHCI (Host) with Integrated PHY (USB1)USB 2.0 OTG Port with Integrated PHY (USB0)USB 2.0 High- and Full-Speed ClientUSB 2.0 High-, Full-, and Low-Speed HostEnd Point 0 (Control)End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TXThree Multichannel Audio Serial Ports (McASPs):Six Clock Zones and 28 Serial Data PinsSupports TDM, I2S, and Similar FormatsDIT-Capable (McASP2)FIFO Buffers for Transmit and Receive10/100 Mbps Ethernet MAC (EMAC):IEEE 802.3 Compliant (3.3-V I/O Only)RMII Media-Independent InterfaceManagement Data I/O (MDIO) ModuleReal-Time Clock with 32-kHz Oscillator and Separate Power RailOne 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)Three Enhanced Pulse Width Modulators (eHRPWMs):Dedicated 16-Bit Time-Base Counter with Period and Frequency Control6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric OutputsDead-Band GenerationPWM Chopping by High-Frequency CarrierTrip Zone InputThree 32-Bit Enhanced Capture (eCAP) Modules:Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) OutputsSingle-Shot Capture of up to Four Event Time-StampsTwo 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball PitchCommercial, Industrial, Extended, or Automotive Temperature
Description
AI
The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.
The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.
The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.
The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with bothRTSandCTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.
The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.
The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.
The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.
The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with bothRTSandCTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.
The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.