74AUP2G00 Series
Automotive 2-ch, 2-input, 0.8-V to 3.6-V low power NAND gates
Manufacturer: Texas Instruments
Catalog(5 parts)
| Part | Current - Output High, Low▲▼ | Current - Quiescent (Max)▲▼ | Number of Circuits▲▼ | Operating Temperature▲▼ | Operating Temperature▲▼ | Package / Case▲▼ | Package / Case | Package / Case▲▼ | Mounting Type | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Max Propagation Delay @ V, Max CL▲▼ | Input Logic Level - High▲▼ | Input Logic Level - High▲▼ | Logic Type | Number of Inputs▲▼ | Supplier Device Package | Grade | Qualification |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
0.004000000189989805 A, 0.004000000189989805 A | 4.999999987376214e-7 A | 2 ul | -40 °C | 85 °C | 0.002311399905011058 m | 8-VFSOP | 0.002300000051036477 m | Surface Mount | 3.5999999046325684 V | 0.800000011920929 V | 6.700000110271276e-9 s | 1.600000023841858 V | 2 V | NAND Gate | 2 ul | ||||
0.004000000189989805 A, 0.004000000189989805 A | 4.999999987376214e-7 A | 2 ul | -40 °C | 85 °C | 8-XFBGA, DSBGA | Surface Mount | 3.5999999046325684 V | 0.800000011920929 V | 6.700000110271276e-9 s | 1.600000023841858 V | 2 V | NAND Gate | 2 ul | 8-DSBGA | |||||
0.004000000189989805 A, 0.004000000189989805 A | 4.999999987376214e-7 A | 2 ul | -40 °C | 85 °C | 8-XFDFN | Surface Mount | 3.5999999046325684 V | 0.800000011920929 V | 6.700000110271276e-9 s | 1.600000023841858 V | 2 V | NAND Gate | 2 ul | 8-X2SON (1.4x1) | |||||
0.004000000189989805 A, 0.004000000189989805 A | 4.999999987376214e-7 A | 2 ul | -40 °C | 85 °C | 8-UFQFN | Surface Mount | 3.5999999046325684 V | 0.800000011920929 V | 6.700000110271276e-9 s | 1.600000023841858 V | 2 V | NAND Gate | 2 ul | 8-UQFN (1.5x1.5) | |||||
0.004000000189989805 A, 0.004000000189989805 A | 4.999999987376214e-7 A | 2 ul | -40 °C | 125 °C | 0.002311399905011058 m | 8-VFSOP | 0.002300000051036477 m | Surface Mount | 3.5999999046325684 V | 0.800000011920929 V | 7.000000135093387e-9 s | 1.600000023841858 V | 2 V | NAND Gate | 2 ul | Automotive | AEC-Q100 |
Key Features
• Qualified for Automotive ApplicationsLow Static-Power Consumption(ICC= 1.7 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 5.9 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIQualified for Automotive ApplicationsLow Static-Power Consumption(ICC= 1.7 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 5.9 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class II
Description
AI
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G00 performs the Boolean function Y =A • Bor Y =A+Bin positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G00 performs the Boolean function Y =A • Bor Y =A+Bin positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.