.200 HI POWER SOCKET ASSEMBLY
| Part | Mounting Type | Number of Positions Loaded | Insulation Material | Number of Rows | Pitch - Mating | Pitch - Mating | Fastening Type | Contact Finish - Post | Contact Material | Contact Type | Termination | Insulation Height | Insulation Height | Contact Shape | Connector Type | Insulation Color | Number of Positions | Contact Length - Post | Contact Length - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Surface Mount | All | Liquid Crystal Polymer (LCP) | 1 | 5.08 mm | 0.2 in | Push-Pull | Tin | Beryllium Copper | Female Socket | Solder | 8.92 mm | 0.351 in | Square | Receptacle | Black | 10 | |||
Samtec Inc. | Through Hole | All | Liquid Crystal Polymer (LCP) | 1 | 5.08 mm | 0.2 in | Push-Pull | Tin | Beryllium Copper | Female Socket | Solder | 8.92 mm | 0.351 in | Square | Receptacle | Black | 10 | 0.102 in | 2.6 mm | |
Samtec Inc. | Through Hole | All | Liquid Crystal Polymer (LCP) | 1 | 5.08 mm | 0.2 in | Push-Pull | Gold | Beryllium Copper | Female Socket | Solder | 8.92 mm | 0.351 in | Square | Receptacle | Black | 10 | 0.102 in | 2.6 mm | Gold |