HPF-10 Series
Manufacturer: Samtec Inc.
.200 HI POWER SOCKET ASSEMBLY
| Part | Contact Shape | Contact Material | Insulation Material | Number of Positions Loaded | Features | Mounting Type | Insulation Color | Number of Positions | Fastening Type | Termination | Pitch - Mating | Contact Type | Contact Finish - Mating | Connector Type | Style | Contact Finish - Post | Insulation Height | Number of Rows | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Board Lock | Surface Mount | Black | 10 | Push-Pull | Solder | 0.2 in | Female Socket | Tin | Receptacle | Board | Tin | 0.351 in | 1 | |
Samtec Inc. | Square | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Board Lock Pick and Place | Surface Mount | Black | 10 | Push-Pull | Solder | 0.2 in | Female Socket | Tin | Receptacle | Board | Tin | 0.351 in | 1 | |
Samtec Inc. | Square | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Through Hole | Black | 10 | Push-Pull | Solder | 0.2 in | Female Socket | Tin | Receptacle | Board | Tin | 0.351 in | 1 | 0.102 in | |
Samtec Inc. | Square | Beryllium Copper | Liquid Crystal Polymer (LCP) | All | Through Hole | Black | 10 | Push-Pull | Solder | 0.2 in | Female Socket | Gold | Receptacle | Board | Gold | 0.351 in | 1 | 0.102 in |