CONN EDGE DUAL FMALE 10POS 0.079
| Part | Card Type | Number of Rows | Pitch [x] | Pitch [x] | Contact Finish | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material | Features | Contact Finish Thickness | Contact Finish Thickness | Color | Gender | Read Out | Mounting Type | Material - Insulation | Card Thickness | Card Thickness | Contact Type | Termination | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Non Specified - Dual Edge | 2 | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | Beryllium Copper | Board Guide Solder Retention | 10 Áin | 0.25 Ám | Natural | Female | Dual | Surface Mount | Liquid Crystal Polymer (LCP) | 0.093 in | 2.36 mm | Cantilever | Solder | 10 |
Samtec Inc. | Non Specified - Dual Edge | 2 | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | Beryllium Copper | Board Guide | 10 Áin | 0.25 Ám | Black | Female | Dual | Through Hole | Liquid Crystal Polymer (LCP) | 0.062 in | 1.57 mm | Cantilever | Solder | 10 |
Samtec Inc. | Non Specified - Dual Edge | 2 | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | Beryllium Copper | Board Guide Pick and Place | 10 Áin | 0.25 Ám | Black | Female | Dual | Surface Mount | Liquid Crystal Polymer (LCP) | 0.062 in | 1.57 mm | Cantilever | Solder | 10 |