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⌘K
SMP MALE PCB SURFACE MOUNT CONNE
| Part | Fastening Type | Center Contact Plating | Mounting Type | Body Finish | Connector Type | Impedance | Operating Temperature [Min] | Operating Temperature [Max] | Number of Ports | Shield Termination | Body Material | Dielectric Material | Features | Mating Cycles | Housing Color | Contact Termination | Center Contact Material | Frequency - Max [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol SV Microwave | Snap-On | Gold | Surface Mount | Gold | Male Pin Plug | 50 Ohms | -65 ░C | 165 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Pre-Tinned (J-STD-001) Smooth Bore | 1000 | Gold | Solder | Beryllium Copper | 25 GHz |
Amphenol SV Microwave | Snap-On | Gold | Through Hole | Gold | Male Pin Plug | 50 Ohms | -55 °C | 125 °C | 1 | Solder | Beryllium Copper | Polytetrafluoroethylene (PTFE) | Full Detent Pre-Tinned | Gold | Solder | Beryllium Copper | 26.5 GHz | |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount | Gold | Male Pin Plug | 50 Ohms | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Smooth Bore | 1000 | Gold | Solder | Beryllium Copper | 26.5 GHz | ||
Amphenol SV Microwave | Snap-On | Gold | Surface Mount Through Hole | Gold | Male Pin Plug | 50 Ohms | -65 ░C | 165 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Full Detent | Gold | Solder | Beryllium Copper | 26.5 GHz | |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount | Gold | Male Pin Plug | 50 Ohms | -55 °C | 125 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Limited Detent | 500 | Gold | Solder | Beryllium Copper | 26.5 GHz |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount Through Hole | Gold | Male Pin Plug | 50 Ohms | -65 ░C | 165 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Pre-Tinned (J-STD-001) Smooth Bore | 1000 | Gold | Solder | Beryllium Copper | 25 GHz |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount Through Hole | Gold | Male Pin Plug | 50 Ohms | -65 ░C | 165 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Full Detent Pre-Tinned | Gold | Solder | Beryllium Copper | 25 GHz | |
Amphenol SV Microwave | Snap-On | Gold | Through Hole | Gold | Male Pin Plug | 50 Ohms | -55 °C | 125 °C | 1 | Solder | Beryllium Copper | Polytetrafluoroethylene (PTFE) | Full Detent | Gold | Solder | Beryllium Copper | 26.5 GHz | |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount | Gold | Male Pin Plug | 50 Ohms | -55 °C | 125 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Full Detent | Gold | Solder | Beryllium Copper | 26.5 GHz | |
Amphenol SV Microwave | Snap-On | Gold | Surface Mount | Gold | Male Pin Plug | 50 Ohms | -65 ░C | 165 °C | 1 | Solder | Beryllium Copper | Polyamide-Imide (PAI) | Full Detent Pre-Tinned | Gold | Solder | Beryllium Copper | 25 GHz |