CONN PCI EXP FMALE 36POS 0.039
| Part | Card Thickness | Card Thickness | Operating Temperature [Max] | Operating Temperature [Min] | Pitch [x] | Pitch [x] | Number of Positions | Gender | Contact Finish | Termination | Material - Insulation | Contact Finish Thickness | Contact Finish Thickness | Mounting Type | Contact Material | Features | Color | Card Type | Read Out | Number of Rows | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Termination Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 36 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.76 Ám | 30 Áin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.38 µm | 15 µin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.38 µm | 15 µin | Surface Mount | Copper Alloy | Board Guide Solder Retention | Black | PCI Express™ | Dual | 2 | 71 | 11 | 2 |
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 98 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.76 Ám | 30 Áin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.38 µm | 15 µin | Surface Mount | Copper Alloy | Board Guide Solder Retention | Black | PCI Express™ | Dual | 2 | 71 | 11 | 2 |
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.76 Ám | 30 Áin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 98 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.38 µm | 15 µin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.38 µm | 15 µin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 164 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.76 Ám | 30 Áin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 | |||
Amphenol ICC (FCI) | 0.062 in | 1.57 mm | 105 ░C | -55 °C | 0.039 in | 1 mm | 98 | Female | Gold | Solder | Liquid Crystal Polymer (LCP) | 0.76 Ám | 30 Áin | Surface Mount | Copper Alloy | Board Guide Locking Ramp Pick and Place Solder Retention | Black | PCI Express™ | Dual | 2 |