TMM-127 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 27POS 2MM
| Part | Material Flammability Rating | Connector Type | Contact Type | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Material | Contact Finish - Mating | Insulation Height | Contact Material | Contact Shape | Pitch - Mating | Style | Contact Finish - Post | Contact Length - Mating | Mounting Type | Insulation Color | Termination | Contact Finish Thickness - Mating | Fastening Type | Number of Positions Loaded | Shrouding | Current Rating (Per Contact) | Number of Rows | Number of Positions | Contact Finish Thickness - Post | Row Spacing - Mating | Contact Length - Post | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | UL94 V-0 | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Gold | 0.126 in | Surface Mount | Black | Solder | 20 Ąin | Push-Pull | All | Unshrouded | 3.2 A | 1 | 27 | 3 µin | |||
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.155 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.126 in | Right Angle Through Hole | Black | Solder | 3 µin | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 0.079 in | 0.12 in | |||
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.155 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.126 in | Right Angle Through Hole | Black | Solder | 10 µin | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 0.079 in | 0.12 in | |||
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Gold | 0.146 in | Through Hole | Black | Solder | 20 Ąin | Push-Pull | All | Unshrouded | 3.2 A | 1 | 27 | 3 µin | 0.118 in | 0.323 in | ||
Samtec Inc. | Header | Male Pin | 105 °C | -55 °C | Liquid Crystal Polymer (LCP) | Tin | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.157 in | Through Hole | Black | Solder | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 0.079 in | 0.106 in | 0.323 in | |||
Samtec Inc. | Header | Male Pin | 105 °C | -55 °C | Liquid Crystal Polymer (LCP) | Tin | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.126 in | Through Hole | Black | Solder | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 0.079 in | 0.138 in | 0.323 in | |||
Samtec Inc. | UL94 V-0 | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Gold | 0.126 in | Surface Mount | Black | Solder | 20 Ąin | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 3 µin | 0.079 in | ||
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.155 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.126 in | Right Angle Through Hole | Black | Solder | 30 µin | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 0.079 in | 0.12 in | |||
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Gold | 0.157 in | Through Hole | Black | Solder | 20 Ąin | Push-Pull | All | Unshrouded | 3.2 A | 2 | 54 | 3 µin | 0.079 in | 0.106 in | 0.323 in | |
Samtec Inc. | Header | Male Pin | 125 °C | -55 °C | Liquid Crystal Polymer (LCP) | Gold | 0.059 in | Phosphor Bronze | Square | 0.079 in | Board Board or Cable | Tin | 0.157 in | Through Hole | Black | Solder | 10 µin | Push-Pull | All | Unshrouded | 3.2 A | 1 | 27 | 0.106 in | 0.323 in |