T2M-120 Series
Headers & Wire Housings High Reliability Tiger Eye Discrete Wire Header, 2.00 mm Pitch
Manufacturer: Samtec Inc.
Catalog
Headers & Wire Housings High Reliability Tiger Eye Discrete Wire Header, 2.00 mm Pitch
Headers & Wire Housings High Reliability Tiger Eye Discrete Wire Header, 2.00 mm Pitch
Headers & Wire Housings High Reliability Tiger Eye Discrete Wire Header, 2.00 mm Pitch
Headers & Wire Housings High Reliability Tiger Eye Discrete Wire Header, 2.00 mm Pitch
| Part | Current Rating (Amps) | Pitch - Mating [x] | Pitch - Mating [x] | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions Loaded | Row Spacing - Mating | Row Spacing - Mating | Contact Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Insulation Material | Contact Material | Contact Finish - Post | Termination | Style | Number of Positions | Shrouding | Fastening Type | Insulation Color | Number of Rows | Insulation Height | Insulation Height | Mounting Type | Connector Type | Features | Contact Length - Post | Contact Length - Post | Overall Contact Length | Overall Contact Length | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | |||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 8 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | Solder Retention | ||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | Pick and Place Solder Retention | ||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | Pick and Place Solder Retention | ||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Through Hole | Header | 0.117 in | 2.97 mm | 0.302 in | 7.67 mm | |||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 30 Áin | 0.76 Ám | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Through Hole | Header | Mating Flange | 0.117 in | 2.97 mm | 0.302 in | 7.67 mm | ||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 30 Áin | 0.76 Ám | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | Pick and Place Solder Retention | ||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | 5.8 mm | 0.228 in | Surface Mount | Header | Solder Retention | ||||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 30 Áin | 0.76 Ám | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | Through Hole Right Angle | Header | 0.09 " | 2.29 mm | 7.44 mm | 0.293 in | |||||
Samtec Inc. | 3.8 A | 0.079 in | 2 mm | Gold | -55 °C | 125 °C | All | 0.079 in | 2 mm | Male Pin | 10 çin | 0.25 çm | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Tin | Solder | Board to Board Cable | 40 | Shrouded - 4 Wall | Push-Pull | Black | 2 | Through Hole Right Angle | Header | Solder Retention | 0.09 " | 2.29 mm | 7.44 mm | 0.293 in |