74AUP2G14 Series
2-ch, 0.8-V to 3.6-V low power inverters with Schmitt-Trigger inputs
Manufacturer: Texas Instruments
Catalog(1 parts)
| Part | Operating Temperature▲▼ | Operating Temperature▲▼ | Input Logic Level - High▲▼ | Input Logic Level - High▲▼ | Logic Type | Mounting Type | Number of Inputs▲▼ | Package / Case | Current - Quiescent (Max)▲▼ | Number of Circuits▲▼ | Current - Output High, Low▲▼ | Features | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Max Propagation Delay @ V, Max CL▲▼ | Supplier Device Package | Input Logic Level - Low▲▼ | Input Logic Level - Low▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
-40 °C | 85 °C | 2.2899999618530273 V | 0.6000000238418579 V | Inverter | Surface Mount | 2 ul | 6-TSSOP, SC-88, SOT-363 | 4.999999987376214e-7 A | 2 ul | 0.004000000189989805 A, 0.004000000189989805 A | Schmitt Trigger | 3.5999999046325684 V | 0.800000011920929 V | 6.20000006890109e-9 s | SC-70-6 | 0.10000000149011612 V | 0.8799999952316284 V |
Key Features
• Available in the Texas Instruments NanoStar PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise — Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.3 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar is a trademark of Texas Instruments.Available in the Texas Instruments NanoStar PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise — Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.3 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar is a trademark of Texas Instruments.
Description
AI
The AUP family is TI's premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G14 contains two inverters and performs the Boolean function Y =A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AUP family is TI's premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G14 contains two inverters and performs the Boolean function Y =A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.