74AUP3G34 Series

3-ch, 0.8-V to 3.6-V low power buffers

Catalog(5 parts)

Part	Voltage - Supply▲▼	Voltage - Supply▲▼	Number of Bits per Element▲▼	Operating Temperature▲▼	Operating Temperature▲▼	Package / Case▲▼	Package / Case	Package / Case▲▼	Mounting Type	Output Type	Logic Type	Current - Output High, Low▲▼	Supplier Device Package
Texas Instruments SN74AUP3G34DCUR Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-VSSOP	3.5999999046325684 V	0.800000011920929 V	1 ul	85 °C	-40 °C	0.002311399905011058 m	8-VFSOP	0.002300000051036477 m	Surface Mount	Push-Pull	Buffer, Non-Inverting	0.004000000189989805 A, 0.004000000189989805 A
Texas Instruments SN74AUP3G34YFPR Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-DSBGA	3.5999999046325684 V	0.800000011920929 V	1 ul	85 °C	-40 °C		8-XFBGA, DSBGA		Surface Mount	Push-Pull	Buffer, Non-Inverting	0.004000000189989805 A, 0.004000000189989805 A	8-DSBGA
Texas Instruments SN74AUP3G34DCURG4 Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-VSSOP	3.5999999046325684 V	0.800000011920929 V	1 ul	85 °C	-40 °C	0.002311399905011058 m	8-VFSOP	0.002300000051036477 m	Surface Mount	Push-Pull	Buffer, Non-Inverting	0.004000000189989805 A, 0.004000000189989805 A
Texas Instruments SN74AUP3G34RSER Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-UQFN (1.5x1.5)	3.5999999046325684 V	0.800000011920929 V	1 ul	85 °C	-40 °C		8-UFQFN		Surface Mount	Push-Pull	Buffer, Non-Inverting	0.004000000189989805 A, 0.004000000189989805 A	8-UQFN (1.5x1.5)
Texas Instruments SN74AUP3G34DQER Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-X2SON (1.4x1)	3.5999999046325684 V	0.800000011920929 V	1 ul	85 °C	-40 °C		8-XFDFN		Surface Mount	Push-Pull	Buffer, Non-Inverting	0.004000000189989805 A, 0.004000000189989805 A	8-X2SON (1.4x1)

Key Features

• Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.3 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar Is a trademark of Texas InstrumentsAvailable in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4.3 pF Typ at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCIoffSupports Partial-Power-Down Mode OperationWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.3 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)NanoStar Is a trademark of Texas Instruments

Description

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The SN74AUP3G34 performs the Boolean function Y = A in positive logic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The SN74AUP3G34 performs the Boolean function Y = A in positive logic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.