CONN IC DIP SOCKET 8POS GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post | Termination | Housing Material | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Type | Type | Type | Mounting Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | Phosphor Bronze | Wire Wrap | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | 0.5 in | 12.7 mm | 8 | DIP | 5.08 mm | 0.2 in | Through Hole | Tin | 0.1 in | 2.54 mm | 3 A | Gold | 200 µin | 5.08 µm | Closed Frame | UL94 V-0 |
Aries Electronics | 125 °C | -55 °C | Phosphor Bronze | Wire Wrap | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | 0.5 in | 12.7 mm | 8 | DIP | 5.08 mm | 0.2 in | Through Hole | Gold | 0.1 in | 2.54 mm | 3 A | Gold | 10 çin | 0.25 çm | Closed Frame | UL94 V-0 |