HEATSINK CPU .91" SQ
| Part | Attachment Method | Package Cooled | Material | Material Finish | Width [y] | Width [y] | Type | Fin Height | Fin Height | Shape | Thermal Resistance @ Natural | Thermal Resistance @ Forced Air Flow | Length [x] | Length [x] | Shelf Life |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products BDN09-3CB | Thermal Tape, Adhesive (Not Included) | ASIC, BGA, CPU, LGA | Aluminum | Black Anodized | 23.11 mm | 0.91 in | Top Mount | 9.02 mm | 0.355 in | Pin Fins, Square | 26.9 °C/W | 9.6 °C/W | 23.11 mm | 0.91 in | |
CTS Thermal Management Products BDN09-3CB/A01 | Thermal Tape, Adhesive (Included) | ASIC, BGA, CPU, LGA | Aluminum | Black Anodized | 23.11 mm | 0.91 in | Top Mount | 9.02 mm | 0.355 in | Pin Fins, Square | 26.9 °C/W | 9.6 °C/W | 23.11 mm | 0.91 in | 24 Months |