BDN09-3CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK CPU .91" SQ
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BDN09-3CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK CPU .91" SQ
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | BDN09-3CB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height | 9.02 mm |
| Fin Height | 0.355 in |
| Length [x] | 23.11 mm |
| Length [x] | 0.91 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC, BGA, LGA, CPU |
| Shape | Square, Pin Fins |
| Thermal Resistance @ Forced Air Flow | 9.6 °C/W |
| Thermal Resistance @ Natural | 26.9 °C/W |
| Type | Top Mount |
| Width [y] | 23.11 mm |
| Width [y] | 0.91 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Box | 1 | $ 1.46 | |
| 10 | $ 1.30 | |||
| 25 | $ 1.24 | |||
| 50 | $ 1.19 | |||
| 100 | $ 1.15 | |||
| 250 | $ 1.10 | |||
| 500 | $ 1.06 | |||
| 1000 | $ 1.02 | |||
| 5000 | $ 0.94 | |||
Description
General part information
BDN09 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources
No documents available