HEATSINK CPU W/ADHESIVE .91"SQ
| Part | Fin Height | Fin Height | Shelf Life | Thermal Resistance @ Natural | Material Finish | Material | Package Cooled | Length [x] | Length [x] | Width [y] | Width [y] | Attachment Method | Thermal Resistance @ Forced Air Flow | Shape | Type | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components  | 9.02 mm  | 0.355 in  | 24 Months  | 26.9 °C/W  | Black Anodized  | Aluminum  | ASIC  BGA  CPU  LGA  | 23.11 mm  | 0.91 in  | 23.11 mm  | 0.91 in  | Thermal Tape  Adhesive (Included)  | 9.6 °C/W  | Pin Fins  Square  | Top Mount  | 
Tusonix a Subsidiary of CTS Electronic Components  | 9.02 mm  | 0.355 in  | 26.9 °C/W  | Black Anodized  | Aluminum  | ASIC  BGA  CPU  LGA  | 23.11 mm  | 0.91 in  | 23.11 mm  | 0.91 in  | Thermal Tape  Adhesive (Not Included)  | 9.6 °C/W  | Pin Fins  Square  | Top Mount  |