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74AHCT16244 Series

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Manufacturer: Texas Instruments

Catalog(3 parts)

PartOutput TypeSupplier Device PackageNumber of ElementsMounting TypeVoltage - SupplyVoltage - SupplyLogic TypePackage / CaseNumber of Bits per ElementCurrent - Output High, LowCurrent - Output High, LowOperating TemperatureOperating TemperaturePackage / CasePackage / Case
Texas Instruments
SN74AHCT16244DLR
Buffer, Non-Inverting 4 Element 4 Bit per Element 3-State Output 48-SSOP
3-State
48-SSOP
4 ul
Surface Mount
5.5 V
4.5 V
Buffer, Non-Inverting
48-BSSOP (0.295", 7.50mm Width)
4 ul
0.00800000037997961 A
0.00800000037997961 A
-40 °C
125 °C
Texas Instruments
SN74AHCT16244DGGR
Buffer, Non-Inverting 4 Element 4 Bit per Element 3-State Output 48-TSSOP
3-State
48-TSSOP
4 ul
Surface Mount
5.5 V
4.5 V
Buffer, Non-Inverting
48-TFSOP
4 ul
0.00800000037997961 A
0.00800000037997961 A
-40 °C
125 °C
0.006099999882280827 m
0.006095999851822853 m
Texas Instruments
74AHCT16244DGGRG4
Buffer, Non-Inverting 4 Element 4 Bit per Element 3-State Output 48-TSSOP
3-State
48-TSSOP
4 ul
Surface Mount
5.5 V
4.5 V
Buffer, Non-Inverting
48-TFSOP
4 ul
0.00800000037997961 A
0.00800000037997961 A
-40 °C
125 °C
0.006099999882280827 m
0.006095999851822853 m

Key Features

Members of the Texas InstrumentsWidebus™ FamilyEPIC™ (Enhanced-Performance Implanted CMOS)ProcessInputs are TTL-Voltage CompatibleDistributed VCCand GND Pins MinimizeHigh-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mAPer JESD 17ESD Protection Exceeds 2000 V PerMIL-STD-883, Method 3015Package Options Include:Plastic Shrink Small Outline (DL) PackageThin Shrink Small Outline (DGG) PackageThin Very Small Outline (DGV) Package380-mil Fine-Pitch Ceramic Flat (WD)Package Using 25-mil Center-to-CenterSpacingsMembers of the Texas InstrumentsWidebus™ FamilyEPIC™ (Enhanced-Performance Implanted CMOS)ProcessInputs are TTL-Voltage CompatibleDistributed VCCand GND Pins MinimizeHigh-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mAPer JESD 17ESD Protection Exceeds 2000 V PerMIL-STD-883, Method 3015Package Options Include:Plastic Shrink Small Outline (DL) PackageThin Shrink Small Outline (DGG) PackageThin Very Small Outline (DGV) Package380-mil Fine-Pitch Ceramic Flat (WD)Package Using 25-mil Center-to-CenterSpacings

Description

AI
The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.