TSW-223 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN HDR .200" 23POS
| Part | Insulation Height | Insulation Material | Operating Temperature (Min) | Operating Temperature (Max) | Fastening Type | Overall Contact Length | Contact Shape | Contact Material | Number of Positions Loaded | Material Flammability Rating | Number of Rows | Termination | Contact Type | Pitch - Mating | Mounting Type | Connector Type | Contact Length - Mating | Insulation Color | Number of Positions | Style | Contact Finish - Post | Contact Length - Post | Shrouding | Contact Finish - Mating | Row Spacing - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | 0.1 in | Polybutylene Terephthalate (PBT) | -55 °C | 105 °C | Push-Pull | 0.43 in | Square | Phosphor Bronze | All | UL94 V-0 | 1 | Solder | Male Pin | 0.2 in | Through Hole | Header | 0.23 in | Black | 23 | Board Board or Cable | Tin | 0.1 in | Unshrouded | Tin | |||
 Samtec Inc. | 0.1 in | Polybutylene Terephthalate (PBT) | -55 °C | 125 °C | Push-Pull | 0.53 in | Square | Phosphor Bronze | All | UL94 V-0 | 2 | Solder | Male Pin | 0.2 in | Through Hole | Header | 0.23 in | Black | 46 | Board Board or Cable | Gold | 0.2 in | Unshrouded | Gold | 0.1 in | 10 µin | 3 µin |
 Samtec Inc. | 0.1 in | Polybutylene Terephthalate (PBT) | -55 °C | 105 °C | Push-Pull | 0.53 in | Square | Phosphor Bronze | All | UL94 V-0 | 1 | Solder | Male Pin | 0.2 in | Through Hole | Header | 0.23 in | Black | 23 | Board Board or Cable | Tin | 0.2 in | Unshrouded | Tin | |||
Samtec Inc. |