IGBT 3 CHIP 600V WAFER
| Part | Test Condition | Td (on/off) @ 25°C | IGBT Type | Supplier Device Package | Current - Collector Pulsed (Icm) | Voltage - Collector Emitter Breakdown (Max) [Max] | Operating Temperature [Min] | Operating Temperature [Max] | Vce(on) (Max) @ Vge, Ic | Package / Case | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | 10 A 15 V 25 Ohm 400 V | 28 ns 198 ns | NPT | Die | 30 A | 600 V | -55 °C | 150 °C | 2.4 V | Die | Surface Mount |
Infineon Technologies | 10 A 15 V 25 Ohm 400 V | 28 ns 198 ns | NPT | Die | 30 A | 600 V | -55 °C | 150 °C | 2.4 V | Die | Surface Mount |