MSPM0L1306-Q1 Series
Automotive 32-Mhz Arm® Cortex®-M0+ with 64-KB flash, 4-KB RAM, 12-bit ADC, OPA,LIN
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
Automotive 32-Mhz Arm® Cortex®-M0+ with 64-KB flash, 4-KB RAM, 12-bit ADC, OPA,LIN
| Part | Speed | Mounting Type | Core Size | Number of I/O | Data Converters | Peripherals | Grade | Core Processor | Program Memory Type | RAM Size | Supplier Device Package | Qualification | Program Memory Size | Package / Case | Oscillator Type | Operating Temperature [Min] | Operating Temperature [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Connectivity | Data Converters [custom] | Data Converters [custom] | Data Converters [custom] | Package / Case [x] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments M0L1306QDGS20RQ1 | 32 MHz | Surface Mount | 32-Bit | 17 | A/D 8x12b SAR | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | Automotive | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 20-VSSOP | AEC-Q100 | 64 KB | 20-TFSOP (0.118 in, 3.00mm Width) | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | |||||
Texas Instruments M0L1306QDYYRQ1 | 32 MHz | Surface Mount | 32-Bit | 13 | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | Automotive | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 16-SOT-23-THIN | AEC-Q100 | 64 KB | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | 12 b | 6 | |||||
Texas Instruments M0L1306QRHBRQ1 | 32 MHz | Surface Mount, Wettable Flank | 32-Bit | 28 | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 32-VQFN (5x5) | 64 KB | 32-VFQFN Exposed Pad | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | 10 | 12 | ||||||
Texas Instruments M0L1306QDGS32RQ1 | 32 MHz | Surface Mount | 32-Bit | 28 | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | Automotive | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 32-VSSOP | AEC-Q100 | 64 KB | 32-TFSOP | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | 10 | 12 | 3 mm | 0.118 in | ||
Texas Instruments M0L1306QRGERQ1 | 32 MHz | Surface Mount, Wettable Flank | 32-Bit | 20 | A/D 9x12b SAR | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | Automotive | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 24-VQFN (4x4) | AEC-Q100 | 64 KB | 24-VFQFN Exposed Pad | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | |||||
Texas Instruments M0L1306QDGS28RQ1 | 32 MHz | Surface Mount | 32-Bit | 24 | Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT | Automotive | ARM® Cortex®-M0+ | FLASH | 4K x 8 | 28-VSSOP | AEC-Q100 | 64 KB | 20-TFSOP (0.118 in, 3.00mm Width) | External, Internal | -40 °C | 125 °C | 1.62 V | 3.6 V | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART | 10 | 12 |
Key Features
• AEC-Q100 qualified for automotive applicationsTemperature grade 1: –40°C to +125°C, TAFunctional Safety Quality-ManagedDocumentation available to aid in functional safety system designCoreArm 32-bit Cortex-M0+ CPU, frequency up to 32 MHzOperating characteristicsWide supply voltage range: 1.62 V to 3.6 VMemoriesUp to 64KB of flashUp to 4KB of SRAMHigh-performance analog peripheralsOne 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channelsConfigurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)Two zero-drift, zero-crossover chopper operational amplifiers (OPA)0.5-µV/°C drift with choppingIntegrated programmable gain stage (1-32x)One general-purpose amplifier (GPAMP)One high-speed comparator (COMP) with 8-bit reference DAC32-ns propagation delayLow power mode down to <1-µAProgrammable analog connections between ADC, OPAs, COMP, and DACIntegrated temperature sensorOptimized low-power modesRUN: 71 µA/MHz (CoreMark)STOP: 151 µA at 4 MHz and 44 µA at 32 kHzSTANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µsSHUTDOWN: 61 nA with IO wakeup capabilityIntelligent digital peripherals3-channel DMA controller3-channel event fabric signaling systemFour 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channelsWindowed watchdog timerEnhanced communication interfacesTwo UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBYTwo I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOPOne SPI supporting up to 16 Mbit/sClock systemInternal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)Data integrityCyclic redundancy checker (CRC-16 or CRC-32)Flexible I/O featuresUp to 28 GPIOsTwo 5-V-tolerant open-drain IOs with fail-safe protectionDevelopment support2-pin serial wire debug (SWD)Package options32-pin VQFN (RHB)32-pin VSSOP (DGS)28-pin VSSOP (DGS)24-pin VQFN (RGE)20-pin VSSOP (DGS)16-pin SOT(DYY)Family members (also see Device Comparison)MSPM0L1304: 16KB of flash, 2KB of RAMMSPM0L1305: 32KB of flash, 4KB of RAMMSPM0L1306: 64KB of flash, 4KB of RAMDevelopment kits and software (also see Tools and Software)LP-MSPM0L1306 LaunchPad™ development kitMSP Software Development Kit (SDK)AEC-Q100 qualified for automotive applicationsTemperature grade 1: –40°C to +125°C, TAFunctional Safety Quality-ManagedDocumentation available to aid in functional safety system designCoreArm 32-bit Cortex-M0+ CPU, frequency up to 32 MHzOperating characteristicsWide supply voltage range: 1.62 V to 3.6 VMemoriesUp to 64KB of flashUp to 4KB of SRAMHigh-performance analog peripheralsOne 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channelsConfigurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)Two zero-drift, zero-crossover chopper operational amplifiers (OPA)0.5-µV/°C drift with choppingIntegrated programmable gain stage (1-32x)One general-purpose amplifier (GPAMP)One high-speed comparator (COMP) with 8-bit reference DAC32-ns propagation delayLow power mode down to <1-µAProgrammable analog connections between ADC, OPAs, COMP, and DACIntegrated temperature sensorOptimized low-power modesRUN: 71 µA/MHz (CoreMark)STOP: 151 µA at 4 MHz and 44 µA at 32 kHzSTANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µsSHUTDOWN: 61 nA with IO wakeup capabilityIntelligent digital peripherals3-channel DMA controller3-channel event fabric signaling systemFour 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channelsWindowed watchdog timerEnhanced communication interfacesTwo UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBYTwo I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOPOne SPI supporting up to 16 Mbit/sClock systemInternal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)Data integrityCyclic redundancy checker (CRC-16 or CRC-32)Flexible I/O featuresUp to 28 GPIOsTwo 5-V-tolerant open-drain IOs with fail-safe protectionDevelopment support2-pin serial wire debug (SWD)Package options32-pin VQFN (RHB)32-pin VSSOP (DGS)28-pin VSSOP (DGS)24-pin VQFN (RGE)20-pin VSSOP (DGS)16-pin SOT(DYY)Family members (also see Device Comparison)MSPM0L1304: 16KB of flash, 2KB of RAMMSPM0L1305: 32KB of flash, 4KB of RAMMSPM0L1306: 64KB of flash, 4KB of RAMDevelopment kits and software (also see Tools and Software)LP-MSPM0L1306 LaunchPad™ development kitMSP Software Development Kit (SDK)
Description
AI
MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power32-bit MSPM0 MCU familybased on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.
The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.
The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.
MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component ofCode Composer Studio™ IDEdesktop and cloud version within theTI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training withMSP Academy, and online support through theTI E2E™ support forums.
For complete module descriptions, see theMSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.
MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power32-bit MSPM0 MCU familybased on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.
The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.
The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.
MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component ofCode Composer Studio™ IDEdesktop and cloud version within theTI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training withMSP Academy, and online support through theTI E2E™ support forums.
For complete module descriptions, see theMSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.