SN74AHCT16541 Series

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Catalog

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Part	Number of Elements	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Logic Type	Number of Bits per Element	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case [y]	Package / Case	Package / Case [y]	Mounting Type	Supplier Device Package	Voltage - Supply [Min]	Voltage - Supply [Max]	Output Type	Package / Case	Package / Case [custom]
Texas Instruments SN74AHCT16541DLR	2	8 mA	8 mA	Buffer Non-Inverting	8	85 °C	-40 °C	0.295 in	48-BSSOP	7.5 mm	Surface Mount	48-SSOP	4.5 V	5.5 V	3-State
Texas Instruments SN74AHCT16541DL	2	8 mA	8 mA	Buffer Non-Inverting	8	85 °C	-40 °C	0.295 in	48-BSSOP	7.5 mm	Surface Mount	48-SSOP	4.5 V	5.5 V	3-State
Texas Instruments SN74AHCT16541DGVR	2	8 mA	8 mA	Buffer Non-Inverting	8	85 °C	-40 °C		48-TFSOP		Surface Mount		4.5 V	5.5 V	3-State	0.173 in 4.4 mm
Texas Instruments SN74AHCT16541DGGR	2	8 mA	8 mA	Buffer Non-Inverting	8	85 °C	-40 °C		48-TFSOP		Surface Mount	48-TSSOP	4.5 V	5.5 V	3-State	0.24 in	6.1 mm

Catalog

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Key Features

• Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessInputs Are TTL-Voltage CompatibleDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessInputs Are TTL-Voltage CompatibleDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.

Description

The 'AHCT16541 devices are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable signals. For either 8-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit buffer section are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54AHCT16541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16541 is characterized for operation from -40°C to 85°C. The 'AHCT16541 devices are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable signals. For either 8-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit buffer section are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54AHCT16541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16541 is characterized for operation from -40°C to 85°C.