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74AUP1G126 Series

Single 0.8-V to 3.6-V low power buffer with 3-state outputs

Manufacturer: Texas Instruments

Catalog(7 parts)

PartNumber of ElementsOperating TemperatureOperating TemperatureNumber of Bits per ElementPackage / CaseLogic TypeOutput TypeCurrent - Output High, LowVoltage - SupplyVoltage - SupplySupplier Device PackageMounting TypeSupplier Device PackageSupplier Device Package
Texas Instruments
74AUP1G126DRLRG4
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-5
1 ul
85 °C
-40 °C
1 ul
SOT-553
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
SOT-5
Surface Mount
Texas Instruments
SN74AUP1G126DRYR
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 6-SON (1.45x1)
1 ul
85 °C
-40 °C
1 ul
6-UFDFN
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
6-SON
Surface Mount
1 ul
1.4500000476837158 ul
Texas Instruments
SN74AUP1G126YZPR
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 5-DSBGA (1.4x0.9)
1 ul
85 °C
-40 °C
1 ul
5-XFBGA, DSBGA
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
5-DSBGA (1.4x0.9)
Surface Mount
Texas Instruments
SN74AUP1G126DCKT
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SC-70-5
1 ul
85 °C
-40 °C
1 ul
5-TSSOP, SC-70-5, SOT-353
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
SC-70-5
Surface Mount
Texas Instruments
SN74AUP1G126DSFR
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 6-SON (1x1)
1 ul
85 °C
-40 °C
1 ul
6-XFDFN
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
6-SON (1x1)
Surface Mount
Texas Instruments
SN74AUP1G126DRLR
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-5
1 ul
85 °C
-40 °C
1 ul
SOT-553
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
SOT-5
Surface Mount
Texas Instruments
SN74AUP1G126DBVT
Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-23-5
1 ul
85 °C
-40 °C
1 ul
SC-74A, SOT-753
Buffer, Non-Inverting
3-State
0.004000000189989805 A, 0.004000000189989805 A
3.5999999046325684 V
0.800000011920929 V
SOT-23-5
Surface Mount

Key Features

Latch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 22−2000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCInput-Disable Feature Allows Floating Input ConditionsIoffSupports Partial-Power-Down Mode OperationInput Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at InputWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.6 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 22−2000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCInput-Disable Feature Allows Floating Input ConditionsIoffSupports Partial-Power-Down Mode OperationInput Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at InputWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.6 ns Maximum at 3.3 VSuitable for Point-to-Point Applications

Description

AI
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity). This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals. To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device. The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity). This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals. To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.