74AUP1G126 Series
Single 0.8-V to 3.6-V low power buffer with 3-state outputs
Manufacturer: Texas Instruments
Catalog(7 parts)
Part | Number of Elements▲▼ | Operating Temperature▲▼ | Operating Temperature▲▼ | Number of Bits per Element▲▼ | Package / Case | Logic Type | Output Type | Current - Output High, Low▲▼ | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Supplier Device Package | Mounting Type | Supplier Device Package▲▼ | Supplier Device Package▲▼ |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments 74AUP1G126DRLRG4Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-5 | 1 ul | 85 °C | -40 °C | 1 ul | SOT-553 | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | SOT-5 | Surface Mount | ||
Texas Instruments SN74AUP1G126DRYRBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 6-SON (1.45x1) | 1 ul | 85 °C | -40 °C | 1 ul | 6-UFDFN | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | 6-SON | Surface Mount | 1 ul | 1.4500000476837158 ul |
Texas Instruments SN74AUP1G126YZPRBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 5-DSBGA (1.4x0.9) | 1 ul | 85 °C | -40 °C | 1 ul | 5-XFBGA, DSBGA | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | 5-DSBGA (1.4x0.9) | Surface Mount | ||
Texas Instruments SN74AUP1G126DCKTBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SC-70-5 | 1 ul | 85 °C | -40 °C | 1 ul | 5-TSSOP, SC-70-5, SOT-353 | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | SC-70-5 | Surface Mount | ||
Texas Instruments SN74AUP1G126DSFRBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 6-SON (1x1) | 1 ul | 85 °C | -40 °C | 1 ul | 6-XFDFN | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | 6-SON (1x1) | Surface Mount | ||
Texas Instruments SN74AUP1G126DRLRBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-5 | 1 ul | 85 °C | -40 °C | 1 ul | SOT-553 | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | SOT-5 | Surface Mount | ||
Texas Instruments SN74AUP1G126DBVTBuffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-23-5 | 1 ul | 85 °C | -40 °C | 1 ul | SC-74A, SOT-753 | Buffer, Non-Inverting | 3-State | 0.004000000189989805 A, 0.004000000189989805 A | 3.5999999046325684 V | 0.800000011920929 V | SOT-23-5 | Surface Mount |
Key Features
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 22−2000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCInput-Disable Feature Allows Floating Input ConditionsIoffSupports Partial-Power-Down Mode OperationInput Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at InputWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.6 ns Maximum at 3.3 VSuitable for Point-to-Point ApplicationsLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 22−2000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoStar™ PackageLow Static-Power Consumption(ICC= 0.9 µA Maximum)Low Dynamic-Power Consumption(Cpd= 4 pF Typical at 3.3 V)Low Input Capacitance (Ci= 1.5 pF Typical)Low Noise – Overshoot and Undershoot<10% of VCCInput-Disable Feature Allows Floating Input ConditionsIoffSupports Partial-Power-Down Mode OperationInput Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at InputWide Operating VCCRange of 0.8 V to 3.6 VOptimized for 3.3-V Operation3.6-V I/O Tolerant to Support Mixed-Mode Signal Operationtpd= 4.6 ns Maximum at 3.3 VSuitable for Point-to-Point Applications
Description
AI
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity).
This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.
To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power FamilyandExcellent Signal Integrity).
This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.
To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.