CONN JACK 1PORT 100 BASE-T PCB
| Part | LED Color | Contact Finish | Housing Material | Contact Finish Thickness | Contact Finish Thickness | Connector Type | Shielding | Number of Rows | Mounting Type | Applications | Orientation | Termination | Number of Ports | Tab Direction | Operating Temperature [Max] | Operating Temperature [Min] | Shield Material | Contact Material | Height Above Board | Height Above Board |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. A63-113-300P13B | Does Not Contain LED | Gold | Polybutylene Terephthalate (PBT), Polyester | 15 µin | 0.38 µm | RJ45 | Shielded | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Down | ||||||
EDAC Inc. A63-113-231N435 | Green, Yellow | Gold | Thermoplastic | 15 µin | 0.38 µm | RJ45 | Shielded, EMI Finger | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Up | 70 °C | 0 °C | Copper Alloy | Copper Alloy | 0.531 in | 13.49 mm |
EDAC Inc. A63-113-331P422 | Green, Yellow | Gold | Thermoplastic | 15 µin | 0.38 µm | RJ45 | Shielded, EMI Finger | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Down | 70 °C | 0 °C | Copper Alloy | Copper Alloy | 0.531 in | 13.49 mm |
EDAC Inc. A63-113-331P4D2 | Green, Yellow | Gold | Polybutylene Terephthalate (PBT), Polyester | 15 µin | 0.38 µm | RJ45 | Shielded, EMI Finger | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Down | 0.531 in | 13.49 mm | ||||
EDAC Inc. A63-113-213N491 | Yellow - Green | Gold | Nylon, Polyamide (PA), Polyester | 15 µin | 0.38 µm | RJ45 | Shielded, EMI Finger | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Up | 70 °C | 0 °C | Copper Alloy | Phosphor Bronze | 0.53 in | 13.45 mm |
EDAC Inc. A63-113-300P131 | Does Not Contain LED | Gold | Polybutylene Terephthalate (PBT), Polyester | 15 µin | 0.38 µm | RJ45 | Shielded | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Down | 0.531 in | 13.49 mm | ||||
EDAC Inc. A63-113-300P422 | Does Not Contain LED | Gold | Thermoplastic | 15 µin | 0.38 µm | RJ45 | Shielded, EMI Finger | 1 | Through Hole | 10/100 Base-T, AutoMDIX | 90 ° | Solder | 1 | Down | 70 °C | 0 °C | Copper Alloy | Copper Alloy | 0.531 in | 13.49 mm |