HDTM Series
Manufacturer: Samtec Inc.
HIGH SPEED / MODULAR CONNECTORS XCEDE HD 1.80 MM HIGH-DENSITY BACKPLANE VERTICAL HEADER
| Part | Operating Temperature (Min) | Operating Temperature (Max) | Mounting Type | Connector Style | Termination | Contact Finish Thickness | Connector Type | Connector Usage | Number of Positions | Number of Columns | Contact Finish | Number of Positions Loaded | Number of Rows | Pitch | Voltage Rating | Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -40 °C | 105 °C | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 36 | 6 | Gold | All | ||||
Samtec Inc. | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 36 | 8 | Gold | All | 6 | 0.071 in | ||||
Samtec Inc. | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 96 | 8 | Gold | All | 12 | 0.071 in | ||||
Samtec Inc. | -40 °C | 105 °C | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 36 | 8 | Gold | All | 6 | 0.071 in | 48 V | |
Samtec Inc. | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 36 | 6 | Gold | All | 6 | 0.071 in | ||||
Samtec Inc. | -40 °C | 105 °C | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 48 | 6 | Gold | All | ||||
Samtec Inc. | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 72 | 6 | Gold | All | 12 | 0.071 in | ||||
Samtec Inc. | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 24 pos | 4 | Gold | All | 6 | 0.071 in | ||||
Samtec Inc. | -40 °C | 105 °C | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 64 | 8 | Gold | All | Black | |||
Samtec Inc. | -40 °C | 105 °C | Through Hole | XCede® | Press-Fit | 30 µin | Header Male Blades | Backplane | 36 | 6 | Gold | All | 6 | 0.071 in | 48 V |