Catalog(5 parts)
| Part | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Features | Operating Temperature▲▼ | Operating Temperature▲▼ | Package / Case▲▼ | Package / Case▲▼ | Package / Case | Supplier Device Package | Output Type | Mounting Type | Type | Max Output Power x Channels @ Load▲▼ | Max Output Power x Channels @ Load▲▼ | Board Type | Utilized IC / Part | Supplied Contents | Amplifier Type | Package / Case▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
2.5 V | 5.5 V | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | 0.0029972000047564507 m | 0.003000000026077032 m | 8-MSOP, 8-TSSOP, Exposed Pad | 8-HVSSOP | 1-Channel (Mono) | Surface Mount | Class AB | 0.699999988079071 W | 1 ul | ||||||
Texas Instruments TPA301EVMTPA301 - 1-Channel (Mono) Output Class AB Audio Amplifier Evaluation Board | 2.5 V | 5.5 V | 1-Channel (Mono) | 0.3499999940395355 W | 1 ul | Fully Populated | TPA301 | Board(s) | Class AB | ||||||||||
2.5 V | 5.5 V | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | 0.0029972000047564507 m | 0.003000000026077032 m | 8-MSOP, 8-TSSOP, Exposed Pad | 8-HVSSOP | 1-Channel (Mono) | Surface Mount | Class AB | 0.699999988079071 W | 1 ul | ||||||
2.5 V | 5.5 V | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | 8-SOIC | 8-SOIC | 1-Channel (Mono) | Surface Mount | Class AB | 0.699999988079071 W | 1 ul | 0.003899999894201755 m | |||||||
2.5 V | 5.5 V | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | 0.0029972000047564507 m | 0.003000000026077032 m | 8-MSOP, 8-TSSOP, Exposed Pad | 8-HVSSOP | 1-Channel (Mono) | Surface Mount | Class AB | 0.699999988079071 W | 1 ul |
Key Features
• Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V - 5.5 VOutput Power for RL= 8350 mW at VDD= 5 V, BTL250 mW at VDD= 3.3 V, BTLUltra-Low Quiescent Current in Shutdown Mode...0.15 µAThermal and Short-Circuit ProtectionSurface-Mount PackagingSOICPowerPAD™ MSOPPowerPAD is a trademark of Texas Instruments Incorporated.Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V - 5.5 VOutput Power for RL= 8350 mW at VDD= 5 V, BTL250 mW at VDD= 3.3 V, BTLUltra-Low Quiescent Current in Shutdown Mode...0.15 µAThermal and Short-Circuit ProtectionSurface-Mount PackagingSOICPowerPAD™ MSOPPowerPAD is a trademark of Texas Instruments Incorporated.
Description
AI
The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.